Fujitsu Corporation

Fujitsu Media Devices Limited

Other

Fijitsu Limited

Ippei Sawaki

Osamu Tsuboi

Satoshi Ueda

Hisao Okuda

Norinao Kouma

Yoshihiro Mizuno

Hiromitsu Soneda

Fumio Yamagishi

Yoshitaka Nakamura

Michio Miura

Mi Xiaoyu

Fumitaka Abe

Tsuyoshi Matsumoto

Xiaoyu Mi

Yoshiro Ishikawa

Takashi Katsuki

Kazunori Miura

Sunao Kurimura

Masafumi Iwaki

Nobuhiro Fukushima

Minoru Seino

Jyoei Kamoi

Kazuo Hajikano

Toshio Shimoe

Koso Murakami

Hirochika Nakajima

Hidehiro Mishiro

A method is provided for making a micromirror unit which includes a frame, a mirror forming base, and bridges connecting the frame to the mirror forming base. The method includes the following steps. First, a first mask pattern is formed on a substrate for masking portions of the substrate which are processed into the frame and the mirror forming base. Then, a second mask pattern is formed on the substrate for masking portions of the substrate which are processed into the bridges. Then, the substrate is subjected to a first etching process with the first and the second mask patterns present as masking means. Then, the second mask pattern is removed selectively. Then, the substrate is subjected to a second etching process with the first mask pattern present as masking means. Finally, the first mask pattern is removed.

Micromirror unit and method of making the same

A method for manufacturing a micro movable element includes: forming a movable section, a frame, and a connecting section connecting the movable section with the frame on a substrate; bonding a film to a surface of the substrate in forming the movable section, the frame, and the connecting section; and patterning the film to form a support structure being bridged between the movable section and the frame.

Method for manufacturing micro movable element

A micro oscillating element includes a frame and an oscillation section connected to the frame via a torsional joining section. The oscillation section includes a movable functional section, an arm section and a first comb-tooth electrode. The arm section extends from the functional section. The first comb-tooth electrode includes first electrode teeth extending from the arm section in a direction intersecting the arm section. The micro oscillating element further includes a second comb-tooth electrode to cooperate with the first comb-tooth electrode for causing the oscillation section to oscillate about an oscillation axis defined by the torsional joining section. The second comb-tooth, electrode includes second electrode teeth extending from the frame in a direction intersecting the arm section.

Micro oscillating comb tooth element with two interesecting oscillation axes

A micro-oscillation element includes a base frame, an oscillating portion, and a link portion connecting the base frame and the oscillating portion to each other. The oscillating portion has a movable functional portion, a first driving electrode connected to the movable functional portion, and a weight portion joined to the first driving electrode. The link portion defines an axis of the oscillating motion of the oscillating portion. The second driving electrode, fixed to the base frame, generates driving force for the oscillating motion in cooperation with the first driving electrode.

Micro-oscillation element provided with weight portion, and array utilizing the same

A microstructure device is made by processing a material substrate consisting of e.g. a first process layer, a second process layer and a middle layer arranged between the first and the second process layers. The microstructure device includes a first structural part and a second structural part that has a portion facing the first structural part via a gap. The first and the second structural parts are connected to each other by a connecting part extending across the gap. This connecting part is formed in the first process layer to be in contact with the middle layer. The microstructure device also includes a protective part extending from the first structural part toward the second structural part or vice versa. The protective part is formed in the first or second process layer to be in contact with the middle layer.

Method of making microstructure device, and microstructure device made by the same

A method of making a microstructure with thin wall portions (T-T) includes a step of performing a first etching process to a material substrate having a laminate structure including a first conductive layer () and a second conductive layer () having a thickness of the thin wall portions (T-T), where the etching is performed from the side of the first conductive layer () thereby forming in the second conductive layer () pre thin wall portions (T-T) which has a pair of side surfaces apart from each other in an in-plane direction of the second conductive layer () and contact the first conductive layer (). The method also includes a step of performing a second etching process from the side of the first conductive layer () for removing part of the first conductive layer () contacting the pre thin wall portions (T-T) to form the thin wall portions.

Method for fabricating microstructure and microstructure

A micromirror unit is provided which includes a frame, a mirror forming base upon which a mirror surface is formed, and a torsion connector which includes a first end connected to the mirror forming base and a second end connected to the frame. The torsion connector defines a rotation axis about which the mirror forming base is rotated relative to the frame. The torsion connector has a width measured in a direction which is parallel to the mirror surface and perpendicular to the rotation axis. The width of the torsion connector is relatively great at the first end. The width becomes gradually smaller from the first end toward the second end.

Micromirror unit with torsion connector having nonconstant width

The micro-actuation element (X) includes a movable unit (), a frame () and a coupler () for connecting these, where the unit, the frame and the coupler are integrally formed in a material substrate having a multi-layer structure that consists of electroconductive layers (-), such as a core conduction layer (), and insulation layers () intervening between the electroconductive layers (-). The movable unit () includes a first structure originating in the core conduction layer (). The frame () includes a second structure originating in the core conduction layer (). The coupler () includes a plurality of electrically separated torsion bars () that originate in the core conduction layer () and are connected continuously to the first structure and the second structure.

Micro-actuation element provided with torsion bars

A micro-oscillation element includes a movable main section, a first frame and a second frame, and a first connecting section that connects the movable main section and the first frame and defines a first axis of rotation for a first rotational operation of the movable main section with respect to the first frame. The element further includes a second connecting section that connects the first frame and the second frame and defines a second axis of rotation for a second rotational operation of the first frame and the movable main section with respect to the second frame. A first drive mechanism is provided for generating a driving force for the first rotational operation. A second drive mechanism is provided for generating a driving force for the second rotational operation. The first axis of rotation and the second axis of rotation are not orthogonal.

Method for driving micro-oscillating element having comb-teeth electrodes

A micro mirror unit includes a moving part carrying a mirror portion, a frame and torsion bars connecting the moving part to the frame. The moving part, the frame and the torsion bars are formed integral from a material substrate. The frame includes a portion thicker than the moving part.

Micro mirror unit and method of making the same

A micro oscillating element is formed integrally from a material substrate made up of a first conductive layer, a second conductive layer and an insulating layer disposed between the first conductive layer and the second conductive layer. This oscillating element includes an oscillation section, an oscillation section supporting frame, and a torsional joining section. The oscillation section includes a movable functional section. The torsional joining section joins the oscillation section and the frame, and also defines an oscillation axis for oscillating action of the oscillation section. The movable functional section is a part formed in the first conductive layer, while the frame is a part formed in the second conductive layer.

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Kawasaki, Japan

Ippei Sawaki