Samsung Electronics Co., Ltd.

Insang Song

Cimoo Song

Hyunjin Kang

Seunghak Lee

Changyul Cheon

Yongwoo Kwon

Seokjin Kang

Chungwoo Kim

Hoon Song

Jungwoo Kim

Youngwoo Kwon

Byong-man Kim

Yong-Gyo Seo

Jae-geun Oh

Chongwoo Kim

Bumkyoo Choi

Provided is a camera module including a housing having an opening, and a first lens assembly configured to move in the housing between a first position in which the first lens assembly is entirely provided in the housing, and a second position in which a portion of the first lens assembly protrudes external to the housing through the opening of the housing, a portion of the first lens assembly being attached to the housing by a magnetic force at the second position.

Camera module and electronic device including the same

An image sensor device includes an image sensor, a substrate including first and second pads spaced apart from each other, a first support member on which an optical filter is mounted, a second support member further adjacent to an outer edge of the substrate than the first support member, and an optical device on the optical filter and the image sensor, wherein the image sensor is electrically connected to the first pad, and wherein at least one of the first or second support members is electrically connected to the second pad.

Image sensor devices

A passive device and a module for a transceiver are provided. The passive device for a transceiver includes a semiconductor substrate or a dielectric substrate, at least one capacitor, a dielectric layer, at least one inductor, a via hole, a metal electrode, radio frequency signal lines, and a radio frequency ground. The at least one capacitor is formed on the substrate. The dielectric layer is formed on the capacitor and the substrate. The at least one inductor is formed on the dielectric layer. The via hole penetrates through the dielectric layer. The metal electrode is formed in the via hole and electrically connects the capacitor and the inductor. The radio frequency signal lines are for the inductor and the capacitor. The radio frequency ground is formed on the substrate and isolated from the radio frequency signal lines. A reduction in the area required for mounting passive devices and modules thereof contributes to the downsizing of communication systems. Also, use of the MEMS technique can reduce insertion loss of inductors, which improves the communication quality of communication systems.

Passive devices and modules for transceiver

A passive device and module for a transceiver, and a manufacturing method thereof are provided. The passive device includes a semiconductor or a dielectric substrate, at least one capacitor, at least one inductor, a viahole, a metal electrode, radio frequency signals, a radio frequency ground, a packaging substrate. The at least one capacitor is formed on a first surface of the substrate. The at least one inductor is formed on a second surface of the substrate that is opposite to the first surface. The viahole penetrates through the substrate. The metal electrode is formed on the viahole and electrically connects the capacitor on the first surface and the inductor on the second surface. Radio frequency signals are for the inductor and the capacitor. The radio frequency ground is formed on the substrate and isolated from the radio frequency signals. The packaging substrate is bonded on the first surface or the second surface of the substrate, having a cavity covering a structure on the bonded surface of the substrate. A reduction in the area required for mounting passive devices and modules thereof contributes to the downsizing of communication systems. Also, use of MEMS technique can reduce insertion loss of inductors, which improves the communication quality of the communication systems.

An electrostatically actuated capacitive MEMS switch includes a plurality of cantilever springs which are actuated parallel to the plane of a substrate. The springs are connected to posts vertically formed on the substrate, and an insulating layer for preventing direct contact between springs and inducing switching depending on a variation in capacitance between the springs is formed on the surface of each of the springs. An opening is formed in the substrate, and the springs are located over the opening. Each of the springs has both lateral portions located on different planes and a slanted middle portion for connecting the two lateral portions to each other.

Electrostatically-actuated capacitive MEMS (micro electro mechanical system) switch

A resonator including a lower substrate having a groove, a dielectric filling the groove, a material film formed on the inner wall of the groove, the material film for preventing the permittivity from suddenly changing between the lower substrate and the dielectric, an upper substrate that is combined with the lower substrate to form a cavity, a conductive thin film formed on the lower surface of the upper substrate to face the dielectric and having a slot in contact with the material film and exposing the dielectric, and a strip line for a wave-guide that is formed on the upper part of the upper substrate and is connected to the conductive thin film. According to the resonator, the size of a cavity corresponding to a given resonance frequency can be reduced by filling a cavity with a dielectric (or magnetic material).

Resonator

A cavity resonator for reducing the phase noise of microwaves or millimeter waves output from a monolithic microwave integrated circuit (MMIC) voltage controlled oscillator (VCO) by using silicon (Si) or a compound semiconductor and a micro electro mechanical system (MEMS), and a method for fabricating the cavity resonator are provided. In the cavity resonator, instead of a conventional metal cavity, a cavity, obtained by finely processing silicon or a compound semiconductor, is coupled to a microstrip line to allow the cavity resonator to be adopted in a reflection type voltage controlled oscillator. A pole is provided to connect the edge of the microstrip line to a predetermined location of a cavity lower thin film. A coupling slot is formed by removing a predetermined width of a cavity upper thin film adjacent to the pole which comes in contact with the cavity upper thin film. A resistive thin film for impedance matching is formed around the cavity lower thin film which comes in contact with the pole. Consequently, the cavity resonator reduces the phase noise of microwaves or millimeter waves which are output from a voltage controlled oscillator.

Cavity resonator for reducing phase noise of voltage controlled oscillator and method for fabricating the same

A semiconducting yttrium-barium-copper-oxygen(YBCO) device which locally converts a semiconducting YBCO film to a nonconducting YBCO film by a conductive atomic force microscope (AFM), a superconducting YBCO device which locally converts a superconducting YBCO film to nonsuperconducting YBCO by an AFM, and manufacturing methods thereof are provided. According to a method of manufacturing a semiconducting YBCO device or a superconducting YBCO device locally converted by an AFM tip, a voltage is applied to the local region of a semiconducting YBCO channel or a superconducting YBCO channel by an AFM tip. This can produce a nonconducting YBCO region or nonsuperconducting YBCO region to thereby manufacture a tunnel junction easily without any patterning process by microfabrication including photolithography and dry/wet etching.

Semiconducting YBCO device and superconducting YBCO device locally converted by AFM tip and manufacturing methods therefor

There is provided a cavity resonator for reducing the phase noise of electromagnetic waves output from a monolithic microwave integrated circuit (MMIC) voltage controlled oscillator (VCO) by utilizing a semiconductor (e.g., silicon, GaAs or InP) micro machining technique. In the cavity, instead of an existing metal cavity, a cavity, which is obtained by micro machining silicon or a compound semiconductor, is coupled to a microstrip line to allow the cavity resonator to be adopted in a reflection type voltage controlled oscillator. A coupling slot is formed by removing a predetermined size of the part of an upper ground plane film of a cavity facing to the microstrip line. Consequently, the cavity resonator reduces the phase noise of microwaves or millimeter waves which are output from a voltage controlled oscillator.

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Yongin, South Korea

Insang Song