Samsung Electronics Co., Ltd.

Inkwon Kim

Sangkyun Kim

Boun Yoon

Byoungho Kwon

Kichul Park

Ki Hoon Jang

Youngbeom Pyon

Hyosan Lee

Sanghyun Park

Wonki Hur

Yearin Byun

A slurry composition for a chemical mechanical polishing (CMP) process, the slurry composition including a first organic polishing booster including a quaternary amine group; a second organic polishing booster including an amino acid; and a carrier; wherein inorganic polishing particles are not included in the slurry composition or included in an amount of less than 0.01% by weight.

Slurry composition for chemical mechanical polishing

A semiconductor device includes a substrate, a peripheral structure, a lower insulating layer, and a stack. The substrate includes a peripheral circuit region and a cell array region. The peripheral structure is on the peripheral circuit region. The lower insulating layer covers the peripheral circuit region and the cell array region and has a protruding portion protruding from a flat portion. The stack is on the lower insulating layer and the cell array region, and includes upper conductive patterns and insulating patterns which are alternately and repeatedly stacked.

Method of fabricating semiconductor device

Semiconductor device and method of fabricating the same

Growing community of inventors

Hwaseong-si, South Korea

Inkwon Kim