Speedfam-ipec Corporation

Speedfam Corporation

Hewlett-packard Company

Speedram Corporation

Inki Kim

Joseph V Cesna

Chris E Karlsrud

John Natalicio

Mark A Meloni

James Schlueter

Thomas K Crosby

Lawrence Vondra

Jim Xu

Mike Park

An improved workpiece carrier assembly includes a workpiece retaining assembly having a plurality of distinct retaining elements rather than a one-piece retaining ring. In accordance with one embodiment, a plurality of retaining segments reside within a like plurality of channels. The retaining segments may be individually or collectively controlled by a pressurized fluid system. In accordance with an alternate embodiment, a plurality of retaining pins reside within a like plurality of guide sleeves. The retaining pins may be individually or collectively controlled by a pressurized fluid system.

Workpiece carrier with segmented and floating retaining elements

The present invention provides methods and apparatus for optimizing the removal of thin film layers during planarization of a semiconductor wafer to achieve global uniformity of the entire semiconductor surface while further achieving the planarity within an individual die structure. A wafer polishing system suitably comprises a wafer polishing apparatus, a controller and a wafer polishing recipe. The wafer polishing recipe may be comprised of various operational parameters utilized for controlling the operation of the polishing apparatus. In a preferred embodiment, the wafer polishing apparatus is initiated with a low down force applied by a carrier apparatus and a high polishing speed applied by a polishing surface to facilitate removal of the thin film layer and optimize the planarity within a single die structure, and then followed with a high down force applied by the carrier apparatus and a low polishing speed applied by the polishing surface to facilitate removal of the thin film layer to optimize the global uniformity of the entire wafer surface. Alternatively, the low down force--high polishing speed and high down force--low polishing speed steps may be reversed without departing from the scope of the invention.

Method and apparatus for improving die planarity and global uniformity

In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.

Method and apparatus for improved semiconductor wafer polishing

A ring extension is provided for use with a semiconductor wafer carrier. The ring extension has a radially inner surface, the lower portion of which contacts a peripheral edge of a wafer to confine the wafer during a polishing operation. A recess or groove is formed in the inner surface and a passageway extending through the ring extension provides pressure relief to prevent slurry build up.

Wafer polishing carrier and ring extension therefor

A carrier for semiconductor wafers to be polished comprises a rigid upper housing, a rigid pressure plate and a gimbal mechanism connecting the plate and housing which permits the plate to gimbal or wobble relative to the housing. The pressure plate is a one-piece component and has a central cut-out portion in which the gimbal mechanism is disposed, thereby establishing a low gimbal point and reducing the incidence of tilting. The gimbal mechanism has an inner bearing ring which is fastened to the underside of the housing, and an outer bearing ring which is fastened to an outer portion of the pressure plate.

Workpiece carrier with monopiece pressure plate and low gimbal point

An apparatus for evenly polishing or planarizing the surfaces of workpieces includes a distributor with a reservoir and a plurality of conduits for uniformly guiding a fluid across a surface of a polishing material. The apparatus is configured to couple to a polishing machine that processes surfaces of workpieces such as semiconductor wafers and computer discs. The reservoir receives a fluid from an exterior source and the fluid is pooled in the reservoir before passing down the conduits to the polishing material. When multiple conduits are employed, the conduits are evenly spaced around the distributor to facilitate uniform application of fluid to a number of locations on the polishing material.

Method and apparatus for distributing a polishing agent onto a polishing

A retainer ring for retaining a thin workpiece during machining thereof, the retaining ring being of a design which facilitates distribution of an abrasive slurry used in the machining operation.

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Tempe, AZ, United States of America

Inki Kim