Samsung Electronics Co., Ltd.

Kmw Inc

Inho Kim

Jongchul Park

Jonghyuk Park

Byoungho Kwon

Inseak Hwang

Yanghee Lee

Hyesung Park

Jin-Woo Bae

Jong-Kyu Kim

Sang-Kuk Kim

Jung-Ik Oh

Byoungjae Bae

Gwang-Hyun Baek

Hyoung-seok Yang

Shin Kwon

Sangmin Lee

Sungwook Lee

Jonghyun Lee

Insun Park

Eunsun Noh

Jongsoon Park

Hyungjoon Kwon

Oik Kwon

Seong-man Kang

Geunwoo Ko

Woohyun Lee

Sangbum Lee

Kiwon Park

Yongmin Kwon

Jinwoo Park

Jaehun Seo

Juhyun Kim

Woosup Lee

Seongmin Je

Yongseok Park

Jin Soo Yeo

Sang-Hee Kim

Dongju Lee

Sanghyun Kim

Jaeyoon Kim

Yeonji Kim

Dongyeoul Lee

Dongsun Lee

Dae-myung Park

Jinha Hwang

Kyungsoo Kwag

Jungkyuen Lee

Kwangyoung Oh

Hyun-woo Yang

Seon Sook Lee

Kyungim Jung

Byungchul Choi

Jungwook Lee

Sungjoon Kim

Jongkeun Song

Oh-seog Choi

Dahyun Choi

Minkyun Kim

Donghyuk Joo

Seungmi Son

Yongwan Lee

Yoon Yong Kim

Myunggil Song

Moonshik Lee

Jin Suk Seo

Jongtak Lee

Kibong Kim

Changwoo Sun

Myung-Hwa Jun

Jeong Uk Park

Daeyeop Han

A semiconductor light emitting device including a substrate; a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on the substrate; a transparent electrode layer on the second conductivity-type semiconductor layer; a first insulating layer on the transparent electrode layer and having a plurality of first through-holes; a multilayer insulating structure on the first insulating layer and having a plurality of second through-holes overlapping the plurality of first through-holes, respectively, the multilayer insulating structure being spaced apart from an edge of the light emitting structure; a reflective electrode layer on the multilayer insulating structure and connected to the transparent electrode layer through the plurality of first through-holes and the plurality of second through-holes; and a second insulating layer between the multilayer insulating structure and the reflective electrode layer.

Semiconductor light emitting device having reflective electrode on multilayer insulating structure

An electronic device is provided. The electronic device includes a communication module, at least one processor, and a memory configured to be operatively coupled to the at least one processor, wherein the memory stores instructions configured to, when executed, cause the at least one processor to identify information on a first country in which the electronic device is located through the communication module, perform payment based on a first authentication method corresponding to the identified information on the first country in response to a first payment application execution request, and change the first authentication method to a second authentication method corresponding to information on a second country in response to detection of a change from the first country to the second country through the communication module.

Electronic device supporting mobile payment, method for operating same, and storage medium

A semiconductor light emitting device is provided. The semiconductor light emitting device includes a plurality of light emitting structures, each of which includes a first surface and a second surface, a plurality of embossed portions provided on the first surface; a partition wall structure provided on the first surface of the plurality of light emitting structures and including a plurality of partition walls which define a plurality of pixel spaces; and a fluorescent layer provided in the plurality of pixel spaces. A bottom surface of the partition wall structure contacts the plurality of embossed portions.

Semiconductor light emitting devices and partition wall structure, and methods of manufacturing the same

The present disclosure in at least one embodiment provides a wireless communication device, comprising a radome comprising a first locking unit and a sealing protrusion formed along at least one side end, a lower case formed along at least one side end and including a sealing protrusion groove which is configured to receive at least part of the sealing protrusion and a second locking unit, and a fastener which is fastened to the first locking unit and the second locking unit to fix the lower case and the radome.

Wireless communication device

A light source module includes a light-emitting cell, a wiring structure provided on the light-emitting cell and connected to the light-emitting cell, a support structure that is apart from the light-emitting cell with the wiring structure therebetween in a vertical direction, a printed circuit board (PCB) that is apart from the wiring structure with the support substrate therebetween in the vertical direction and overlapping the light-emitting cell in the vertical direction, and at least one insulating film that is apart from the wiring structure in the vertical direction and covering at least one of a first surface of the support substrate, which faces the wiring structure, and a second surface of the support substrate, which faces the PCB.

Light source module including light-emitting diode

A semiconductor light-emitting device includes a light-emitting pixel region and a pad region, and includes light-emitting structures, a partition wall structure, a passivation structure, and a fluorescent layer, positioned in the light-emitting pixel region, and a pad unit positioned in the pad region. The partition wall structure includes partition walls defining pixel spaces. The passivation structure surrounds the partition walls and includes a first passivation layer including a first insulating material and a second passivation layer including a second insulating material different from the first insulating material. The passivation structure includes a first portion on a top surface of the partition walls, a second portion on a sidewall of the partition walls, and a third portion between the light-emitting structures and the fluorescent layer. A first thickness of the first portion is less than or equal to a second thickness of the second portion.

Semiconductor light-emitting devices and methods of manufacturing the same

The present disclosure provides a shield wall for shielding multiple individual antenna modules of a massive MIMO antenna from each other. A shield wall according to at least one embodiment of the present disclosure is formed by a plurality of staple-shaped unit partitions arrayed longitudinally of the shield wall, wherein the unit partitions are designed to have optimal widths and heights according to the frequency band in use, and are arranged at a predetermined interval or less with reference to the frequency band in use, thereby providing an antenna structure which satisfies both the X-POL isolation and CO-POL isolation characteristics and can be easily fabricated in a compact, lightweight design.

Antenna device

Provided a manufacturing method of a semiconductor light emitting device including forming a plurality of light emitting cells that are separated on a first substrate, forming a first planarization layer by providing an insulating material on the plurality of light emitting cells, forming a second planarization layer by providing a photoresist on the first planarization layer to have a flat upper surface, and soft baking the photoresist, and dry etching the second planarization layer to a predetermined depth to expose a portion of the first planarization layer provided on the plurality of light emitting cells, and a portion of the second planarization layer remaining between the plurality of light emitting cells on the first planarization layer, wherein forming the second planarization layer and dry etching are repeated at least once to remove the portion of the second planarization layer provided between the plurality of light emitting cells.

Manufacturing method of semiconductor light emitting device

A device and a method for authenticating an application in an execution environment in a trust zone are provided. The method includes executing a client application (CA) in a normal world, receiving, in the normal world, a request for receiving a service of a trusted application (TA) of a secure world from the CA, acquiring, when the request is received in the normal world, source information of the CA loaded in a memory of the device, acquiring, in the normal world, first hash information from the source information, providing, to the secure world, the first hash information together with signature information and a sub certificate included in the CA, and authenticating the CA based on the sub certificate and a root certificate of the TA in the secure world.

Device and method for authenticating application in execution environment in trust zone

Provided, as a multi-divisional antenna, in the present disclosure, is a canister antenna having a plurality of divided antennas arranged so as to have an integrated appearance. The antennas are fixed to an adapter with strong tension by using a connection member such as a wire. The multi-divisional antenna according to the present disclosure is solid, low cost, and convenient with respect to manufacturing, installation, and maintenance.

Multi-divisional antenna

A method of operating an electronic device capable of operating a plurality of execution environments including a first execution environment and a second execution environment is provided. The method includes generating a first authentication value, using a first application executed in the first execution environment, transmitting the first authentication value from the first application through the second execution environment to a second application executed in the first execution environment, transmitting, based on reception of the first authentication value, a second authentication value and a result of authentication of the user from the second application to the first application through the second execution environment, and performing, when the second authentication value corresponds to the first authentication value, payment based on the result of the authentication, using the first application.

Electronic device providing electronic payment function and operating method thereof

An extendable cable distribution device in accordance with an embodiment of the present disclosure can include a main block for receiving the end portion of a composite cable supplied from the outside, and providing the passage through which the received composite cable is distributed; at least one sub-block located to be detachable at one side of the main block, and for guiding the distribution direction of a part of the composite cable distributed while passing through the main block; and a connector located on the outer circumferential surface of the at least one sub-block, and electrically connected with at least part of the distributed cable. According to an embodiment of the present disclosure, it is possible to provide the cable distribution device capable of distributing the supplied composite cable and rotating the distributed cable depending upon the direction extended to the outside. In addition, according to an embodiment of the present disclosure, when the distributed cable is added, it is possible to simply extend the cable by the number or in the direction desired by an installer by additionally mounting the modular sub-block.

Extendable cable distribution device and method for manufacturing extendable cable distribution device

Provided are a semiconductor device and a method of fabricating the same. The semiconductor device may include a semiconductor substrate including a first region and a second region, a dummy separation pattern provided on the second region of the semiconductor substrate to have a recessed region at its upper portion, a first electrode provided on the first region of the semiconductor substrate, a dielectric layer covering the first electrode, a second electrode provided on the dielectric layer, and a remaining electrode pattern provided in the recessed region. The second electrode and the remaining electrode pattern may be formed of a same material.

Semiconductor device and method of fabricating the same

A method of fabricating a semiconductor device includes providing a substrate including a pair of first regions and a second region therebetween, forming first patterns on the respective first regions to at least partially define a stepwise portion at the second region, and forming a dummy pattern that at least partially fills the stepwise portion. The dummy pattern may be an electrically floating structure. The dummy pattern may be formed as part of forming second patterns on the respective first regions, and the dummy pattern and the second patterns may include substantially common materials. Because the dummy pattern at least partially fills the stepwise portion at the second region, the material layer covering the second patterns and the dummy pattern may omit a corresponding stepwise portion.

Method of fabricating semiconductor device

Growing community of inventors

Suwon-si, South Korea

Inho Kim