Samsung Electro-mechanics Co., Ltd.

In Young Kang

Seung Mo Lim

Tae Kyung Lee

Kyo Yeol Lee

No Il Park

Ran Hee Shin

Byeong Cheol Moon

Sung Woo Han

Jeong Hoon Ryou

Ho Phil Jung

Jae Sang Lee

Jung Min Kim

Jeong Ryeol Kim

Hyun Ho Shin

Tae Joon Park

Yun Sung Kang

Jin Suk Son

Jong Pil Lee

Hai Joon Lee

Tae Jun Choi

Seung Hun Han

Sung Sun Kim

Je Hong Kyoung

Dong Joon Oh

Tai Yon Cho

Doo Ho Park

Sung Wook Kim

Yun Hee Kim

Young Sun Kim

Tae Yoon Kim

Moon Chul Lee

Jong Woon Kim

Won Jae Han

Tae Hun Lee

Jae Chang Lee

Sung Min Cho

Sung Hee Kim

Il Ro Lee

Kwang Il Park

In Suk Kim

Sung Kwon Oh

A coil component includes: a body having one surface and the other surface opposing each other, and one end surface and the other end surface; a wound coil disposed in the body; first and second lead-out portions extending from opposite ends of the wound coil to one surface of the body; and first and second external electrodes disposed on the body and connected to the first and second lead-out portions, respectively, each formed to have a plurality of layers, wherein the first and second external electrodes include first and second pad portions and connected to the first and second lead-out portions, respectively, and first and second extension portions disposed on one end surface and the other end surface of the body, respectively, and first layers of the first and second extension portions are conductive resin layers, and first layers of the first and second pad portions are first metal layers.

Coil component

A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer; and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer. The first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.

Multilayer ceramic electronic component including external electrodes having improved reliability

A coil electronic component includes a body having one surface and the other surface, opposing each other, and a plurality of wall surfaces respectively connecting the one surface and the other surface of the body, first and second recesses, respectively formed in both end surfaces of the body opposing each other among the plurality of wall surfaces of the body, extending to the one surface of the body, a wound coil, embedded in the body, including first and second lead-out portions, a first external electrode disposed along an internal wall of the first recess and the one surface of the body and connected to the first lead-out portion, and a second external electrode disposed along an internal wall of the second recess and the one surface of the body and connected to the first lead-out portion. The first and second external electrodes are spaced apart from each other.

Coil electronic component

A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.

Multilayer ceramic electronic component

A coil component includes a body having both end surfaces opposing each other in a length direction; a support substrate disposed in the body; a coil portion disposed on the support substrate in a width direction of the body, and including first and second lead-out portions each exposed to a first surface and a second surface of the body opposing each other in a thickness direction of the body, respectively, and disposed on the support substrate; and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, and connected to one ends of the first and second lead-out portions exposed to the first surface of the body, respectively.

A coil component includes a body having one surface and the other surface and a plurality of wall surfaces, first and second insulating substrates spaced apart from each other, first and second recesses disposed in both end surfaces of the body and extending to one surface of the body, first and second coil portions disposed on the first and second insulating substrates, one ends and the other ends of the first and second coil portions being exposed to the first and second recesses, first and second external electrodes disposed along an inner surface of the first recess and one surface of the body and connected to one ends of the first and second coil portions, and third and fourth external electrodes disposed along an inner surface of the second recess and one surface of the body and connected to the other ends of the first and second coil portions.

A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode formed on the substrate, and a piezoelectric layer provided between the first electrode and the second electrode. Either one or both of the first electrode and the second electrode include a molybdenum-tungsten alloy having a weight ratio of molybdenum to tungsten in a range of 3:1 to 1:3.

Bulk acoustic wave resonator and filter including the same

A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.

Bulk acoustic wave resonator device

A bulk acoustic resonator includes a substrate, a first electrode disposed above the substrate, a piezoelectric body disposed on the first electrode and including a plurality of piezoelectric layers each including aluminum nitride with a doping material, and a second electrode disposed on the piezoelectric body, where at least one of the piezoelectric layers is a compressive piezoelectric layer formed under compressive stress.

Bulk acoustic resonator and filter

A thin film capacitor includes a body including alternately stacked first and second electrode layers and dielectric layers on a substrate, the second electrode layer including a second lower electrode layer and a second upper electrode layer formed on the second lower electrode layer, the second lower electrode layer including a material having a higher band gap energy than the first electrode layer and the second upper electrode layer.

Thin film capacitor

A piezoelectric oscillator, and method of making the same, includes an oscillation substrate comprising an oscillating part and a surrounding part, wherein the surrounding part is thinner than the oscillating part, and oscillating electrodes disposed on an upper surface and a lower surface of the oscillating part. The oscillation substrate is configured according to H=400.59&#xd7;S+1.75&#xb1;1.5, wherein H=100&#xd7;(T/T) and S=T/(L&#x2212;L), wherein Lrepresents an entire length of the oscillation substrate, Lrepresents a length of the oscillating part, Trepresents a thickness of the oscillating part, and Trepresents a step height between the oscillating part and the surrounding part.

Piezoelectric oscillator and method of making the same

A capacitor includes: a substrate including a plurality of trenches and a capacitance formation portion, and a margin portion disposed around the capacitance formation portion; dielectric layers disposed on one surface of the substrate and filling the trenches; a plurality of first electrode layers each disposed on one surface of the dielectric layer and each including a first lead portion led out from the capacitance formation portion to the margin portion; and a plurality of second electrode layers each disposed on one surface of the dielectric layer to face the first electrode layer with each of the dielectric layers interposed therebetween, and each including a second lead portion led out from the capacitance formation portion to the margin portion, wherein the first and second lead portions of the plurality of first and second electrode layers are stacked in a stepped shape inclined in a direction from the margin portion to the capacitance formation portion.

Capacitor

A capacitor includes a body including a substrate having first and second capacitor regions, and first to third terminal electrodes disposed on an external surface of the body. The first capacitor region includes a plurality of first trenches, and a first capacitor layer disposed on one surface of the substrate and in the first trenches in the first capacitor region and including at least one first dielectric layer and first and second electrodes disposed with the at least one first dielectric layer interposed therebetween. The second capacitor region includes a plurality of second trenches, and a second capacitor layer disposed on one surface of the substrate and the second trenches in the second capacitor region and including at least one second dielectric layer and third and fourth electrodes disposed with the at least one second dielectric layer interposed therebetween. The second capacitor layer has a specific surface area greater than that of the first capacitor layer.

Capacitor and board having the same

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Suwon-si, South Korea

In Young Kang