Samsung Electronics Co., Ltd.

In Won O

Yunseok Choi

Jung Ho Park

Woojae Kim

Yechung Chung

YoungHoon Ro

HanShin Youn

Hak Jun Kim

A printed circuit board that includes a base layer having a first surface and a second surface opposing each other. A first structure is disposed on the first surface of the base layer. The first structure includes a first plate structure. A first connection structure is disposed on a same plane as the first plate structure and is spaced apart from the first plate structure. The first plate structure includes first openings. At least some of the first openings are linear openings having a line shape.

Printed circuit board and semiconductor package including the same

Provided is a semiconductor package including: a semiconductor chip mounted on a die pad; at least one lead connected electrically to the semiconductor chip; and a flexible film substrate including a metal wiring, which electrically connects the semiconductor chip and the at least one lead, wherein the semiconductor chip is electrically connected to the film substrate through a first connection member which contacts the semiconductor chip and the metal wiring; and the film substrate is electrically connected to the at least one lead through a second connection member which contacts the metal wiring and the at least one lead.

Semiconductor packages

Growing community of inventors

Jeonju-si, South Korea

In Won O