Fairchild Semiconductor Corporation

In Suk Kim

Leocadio Morona Alabin

Manolito Galera

Manolito Fabres Galera

Semiconductor packages that contain multiple stacked chips that are embedded in a pre-molded carrier frame and methods for making such semiconductor packages are described. The semiconductor packages contain a full land pad array and multiple chips that are stacked vertically. The land pad array contains inner terminals that are formed by first stud bumps that are located on a lower die. The land pad array also contains middle terminals that are formed by first conductive vias in a first molding layer embedding the first die. The first conductive vias are connected to second stud bumps that are located on a second die that is embedded in a second molding layer. The second molding layer contains second conductive vias that are connected to a carrier frame, the bottom of which forms the outer terminals of the land pad array. The semiconductor packages therefore have a high input/output capability with a small package footprint, and a flexible routing capability that are especially useful for portable and ultra-portable electronic apparatus. Other embodiments are also described.

Stackable semiconductor package with embedded die in pre-molded carrier frame

Semiconductor packages and methods for making and using the same are described. The semiconductor packages contain a lead frame that has been folded to create folded leads that form a customized array of land pads and vias. The lead frame contains both longer folded lead and shorter folded leads. The longer leads can be folded so that an upper part of the longer leads form vias, the lower part forms part of a land pad array, and a substantially flat part that is connected to a first die containing an IC. The shorter leads can be folded so that a lower part forms part of a land pad array and the short leads are connected to a second die containing in IC. The folded leads can be routed according to the requirements of each specific IC die to which they are connected and therefore can support multiple dies in the semiconductor package. Other embodiments are also described.

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In Suk Kim