Samsung Electronics Co., Ltd.

In Sik Cho

Hee Kook Choi

Tae Hyeong Kim

Hee Sun Rho

Tae Sung Park

Sang Hyeop Lee

Gi Su Yoo

A packaged semiconductor device may include a substrate including at least one device layer and at least one connector arranged thereon, and a resin cover covering each side of the substrate, the resin cover on at least one side of the substrate including an opening exposing the connector and the resin cover on at least one other side of the substrate exposing a portion of the substrate.

Encapsulated wafer level package with protection against damage and manufacturing method

A semiconductor device package is equipped with devices for preventing the formulation of air traps in its encapsulated package body. These devices include dummy block leads formed on the outermost inner lead of each row of inner leads, and extended portions formed on each tie bar. Each dummy block lead extends from the end of an outermost inner lead and is integrally formed therewith. The tie bar extended portions are separated into several parts defined by spaces between the parts, and the several parts are formed integral with each other and with the tie bar. The dummy block leads and the tie bar extended portions may be formed so as to be inclined relative to horizontal and with jagged edges at their side surfaces. The dummy block leads and tie bar extended portions serve to reduce the velocity of the potting resin which forms the encapsulate, as it enters the die cavity for encapsulation, but before the resin actually contacts the chip or the inner leads. Thereby, the flow velocity at various points within the mold cavity is uniform, and formation of air traps is prevented.

Semiconductor device packages having dummy block leads and tie bars with

A semiconductor device package includes a semiconductor chip and a plurality of inner leads, each having at least one slot formed along an upper surface of the inner lead. An adhesive layer is used to attach a bottom surface of the semiconductor chip to the upper surface of the inner lead. An encapsulant is allowed to flow in a package body mold, around the inner leads and through the slot. The slots prevent the production of turbulence along a side surface of the inner lead opposite to the flow direction, thereby avoiding problems associated with incomplete encapsulation such as the internal voids.

Semiconductor device package having inner leads with slots

An improved mold for forming a semiconductor package, having a molding compound injection gate having a height not greater than the thickness of the lead frame of the semiconductor assembly placed in the mold.

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Cheonan, South Korea

In Sik Cho