Samsung Electronics Co., Ltd.

Korea Advanced Institute of Science and Technology

In-Sang Song

Sang-Hun Lee

Sang-Wook Kwon

Hyung Jin Choi

Il-Jong Song

Yun-kwon Park

Dong-Kyun Kim

Young-Il Kim

Che-Heung Kim

Dong-Ki Min

Eun-Sung Lee

Jong-Seok Kim

Hyunjin Kang

Jung-Eun Lee

In-Ku Kang

Hyunsu Jun

Dong-ha Shim

Duck-Dong Hwang

Kyung-Man Kim

Kuang-Woo Nam

Chul-Soon Park

Inn-Yeal Oh

Joong-Ho Lee

Won-Suk Choi

Sun-Hee Park

Seung Hak Lee

Duck-Hwan Kim

Chae-Jun Lee

Seog-Woo Hong

Yun-Kwon Park

Hae-Seok Park

Byeoung-Ju Ha

Seok-Chul Yun

Young-Tack c/o Samsung Adv Inst Of Techn Houng

Jun-O 705-604 Manhyeon-Maeul Kim

Chung-Woo 101-705 Park Town Daelim Apt Kim

Moon-Chul Lee

Young-Tack Hong

Sang-Chae 902-2001 Jugong Apartment Kim

Dong-Ha Shim

Jun-Sik 301-1402 Hanwha Apartment Hwang

Jong-Seok 101-202 Hyundai Apt Kim

Duck-Hwan 601-909 Hanyang Apartment Kim

Byeoung-Ju 507-1401 Samsung 5Th Apt Ha

Jun-Sik Hwang

Yeoung-Ju 507-1401 Samsung 5Th Apartment Ha

Ii-Jong Song

Chang-Seung Lee

An electronic system including a camera module comprises a camera module on a metal plate, a metal flange surrounding the camera module, a metal frame connected to the metal flange, and a first adhesion member between the metal flange and the metal plate. The camera module includes a substrate including a cavity, an image sensor in the cavity, and a lens assembly on the image sensor. An area of the metal plate is greater than that of the substrate, from a plan view. The metal plate includes a first part overlapping the substrate from the plan view, and a second part not overlapping the substrate from the plan view. The second part corresponds to an edge portion of the metal plate. The image sensor contacts the metal plate through an adhesive material. A lower portion of the metal flange and the second part of the metal plate contact the first adhesion member.

Electronic device including camera module

An image sensor chip includes a substrate; an image sensor chip provided on the substrate; and an adhesive film provided between the image sensor chip and the substrate in a semi-cured state. A first width of the adhesive film is equal to a second width of the image sensor chip.

Image sensor package

A wireless communication system provides an antenna apparatus for the wireless communication system. The antenna apparatus includes a base, a plurality of Yagi-Uda antenna modules disposed in a specific arrangement, a plurality of floating metal modules correspondingly installed in upper portions of the Yagi-Uda antenna modules and selectively connected to a corresponding Yagi-Uda module among the plurality of Yagi-Uda antenna modules, a switching element for selectively switching the floating metal module and the Yagi-Uda antenna module, and a controller for controlling the Yagi-Uda antenna module to comprise a directivity in a desired direction by selectively switching the switching element.

Method and apparatus for beamforming

An antenna device in a wireless communication includes antenna wires of four sides which include three feeding points and have a loop structure and four main switches which are located among the antenna wires of the four sides, wherein the antenna device operates as a loop antenna when the antenna wires of the four sides are connected according to operations of the main switches and wherein the antenna device operates as dipole antennas when the antenna wires of the four sides are disconnected according to operations of the main switches.

Antenna structure in wireless communication system and operation method thereof

Provided are a semiconductor device and a method of fabricating the same, and more particularly, a semiconductor package and a method of fabricating the semiconductor package. The semiconductor package includes a first package that comprises a first substrate, at least one first semiconductor chip stacked on the first substrate, and first conductive pads exposed on a top surface of the first substrate; a second package disposed below the first package such that the second package comprises a second substrate, at least one second semiconductor chip, and second conductive pads exposed on a bottom surface of the second substrate; and a connection unit that extends from the first conductive pads to the second conductive pads such that the connection unit covers a side surface of the first package and a side surface of the second package in order to electrically connect the first package to the second package.

Semiconductor package and method of fabricating the same

Growing community of inventors

Daejeon, South Korea

In-Sang Song