Industrial Technology Research Institute

In-Mau Chen

Hsien-Yin Tsai

Chih-Hsiang Lin

Wen-Faa Kuo

Jing-Cherng Tsai

Jeng-Yue Wu

Joung-Yei Chen

Bor-Ping Wang

Chi-Lan Li

Wen-Ling Lui

Wei-Han Liao

Hsun-Yu Lee

Huai-Mei Chou

Wee-Pin Chao

A thermal responsive, water soluble copolymer is disclosed, which comprises the co-polymerization product of: (a) 0.5&#x2dc;20 wt % of N-isopropyl acrylamide (NIPAAm); (b) 0.5&#x2dc;20 wt % of 1-vinyl-2-pyrrolidinone (VPD); (c) 0.01&#x2dc;10 wt % of acrylic acid (AA); and (d) 80&#x2dc;90 wt % of acrylamide. The viscosity of.the co-polymerization product is adjustable by temperature. Moreover, phase-separating does not occur in the copolymer while temperature is changing and the structure as well as the fluidity are maintained, therefore, the copolymer of the present invention is suitable for the application of a micro-fluidic chip.

Thermo-responsive water-soluble polymers for viscosity switch

A thermal responsive, water soluble polymer. The polymer comprises the co-polymerization product of: (a) 5&tilde;95 wt % of N-isopropyl acrylamide (NIP); (b) 0.1&tilde;80 wt % of 1-vinyl-2-pyrrolidinone (VPD); and optionally, (c) 0.1&tilde;30 wt % of acrylic acid (AA). As the proportion of component (b) VPD increases, the Lower Critical Solution Temperature (LCST) and water solubility of the polymer increases. On the other hand, as the proportion of component (c) AA increases, the Lower Critical Solution Temperature (LCST) decreases and the COOH reactive groups increases, which impart high reactivity to the copolymer. By adjusting the proportion of the monomers, a broad range of LCST can be manipulated from about 20 to 80&deg; C.

Thermal responsive, water-soluble polymers

Graft copolymer of syndiotactic styrene copolymer

Disclosed is a sPS nanocomposite with improved crystallization properties and higher mechanical strength, which comprises a polymer matrix containing syndiotactic polystyrene (sPS), and a layered clay material uniformly dispersed in the polymer matrix. The layered clay material is intercalated with an organic onium cation and optionally along with a polymer or oligomer which is compatible or partially compatible with sPS. The interlayer distances of the layered clay material are at least 20 &angst;. The sPS nanocomposite can be prepared by ways of in-situ polymerization, melt blending, or solution blending. According to the invention, the layered clay material dispersed in the sPS matrix not only leads to higher mechanical strength, but also, surprisingly, improves crystallization properties of sPS.

sPS nanocomposite and processes for producing the same

A low dielectric constant composition used in electric circuit boards is disclosed. The composition includes (a) 20-99.9 parts by weight of a functionalized syndiotactic styrene/para-alkystyrene copolymer having microfoaming when being cured; (b) 0.01-80 parts by weight of a mixture of epoxy resins; and (c) less than 50 parts by weight of a curing agent.

Carboxyl or anhydride-functional styrene/p-alkylstyrene copolymer, epoxy resin and curing agent

A resin composition which increases the copper peeling strength and improves the dielectric properties of electric circuit boards is disclosed. The resin composition comprises: (a) 20-100 parts by weight of a syndiotactic polystyrene, (b) 1-40 parts by weight of a functionalized syndiotactic styrene-based copolymer having microfoaming when being cured, (c) 1-40 parts by weight of an epoxy-styrene copolymer, and (d) 0-40 parts by weight of an additive.

Resin compositions for electric circuit boards

Growing community of inventors

Hsinchu, Taiwan

In-Mau Chen