Semes Co., Ltd.

Other

In Kyu Park

Yong Seok Jang

Chung Woo Lee

Sung Youn Jeon

The present disclosure provides a control device for charging and auto teaching of a wafer type sensor, a control program executed by the control device, a wafer type sensor storage device, a wafer type sensor charging device, and a semiconductor device manufacturing facility. The control program is a program executed by a control device equipped with a processor, and monitors a semiconductor device manufacturing facility and its part using a wafer type sensor, and monitors the remaining battery level of the wafer type sensor.

Control program, container and semiconductor device manufacturing system for charging of wafer type sensor and auto teaching

Provided is a gap measuring method capable of accurately measuring a gap between adjacent members. The gap measuring method includes preparing an equipment to be measured including a first member and a second member, obtaining a first image by capturing the equipment to be measured using a photographing module of a first setting while irradiating a laser to the equipment to be measured, wherein the first image includes a first laser line image corresponding to a surface of the first member and a second laser line image corresponding to a surface of the second member, modifying the photographing module from the first setting to a second setting based on a maximum width of the second laser line image in the first image, obtaining a second image by capturing the equipment to be measured using the photographing module of the second setting while irradiating a laser to the equipment to be measured, and calculating a gap between the first member and the second member based on a discontinuous region between the first laser line image and the second laser line image in the second image.

Apparatus and method for measuring the gap

A support unit may include a plurality of heaters disposed in a matrix form in the support unit to heat a substrate, and a power supply unit for supplying power to the plurality of heaters, wherein a current applied to the plurality of heaters is controlled by switches connected to rows and columns of the matrix, respectively, and the switches connected to the rows of the matrix include first switches capable of controlling the current applied to the rows of the matrix and second switches connected in parallel with the first switches.

Support unit, substrate treating apparatus including the same and temperature control method

A laser needle treatment system according to the present invention comprises: an optical cable connected to a laser generator and providing a laser generated by the laser generator; a hand piece in which a plurality of lenses for amplifying or extending the laser provided from the optical cable are installed; and a needle unit connected to the bottom of the hand piece to receive a laser through the hand piece and pass through the skin surface so as to directly emit the laser intradermally to an operation area, wherein the hand piece comprises: a focus lens to which the laser provided from the optical cable is incident; a convex lens for extending or amplifying a laser emitted from the focus lens; a collimator lens for emitting the laser emitted from the convex lens to be parallel to a proceeding direction; and an optical lens part connected to the needle unit and including a plurality of optical lenses Installed therein to extend or amplify a laser emitted from the collimator lens and transmit the same to the needle unit.

Laser needle treatment system

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an index unit including a load pot, in which a container is seated, and an index chamber connected to the load pot, and a process executing unit having a load lock chamber connected to the index chamber and a process chamber that treats a substrate transferred to the load lock chamber, the index unit further includes an alignment unit provided in the index chamber and that aligns a substrate type sensor transferred to the process chamber.

Substrate treating apparatus

Disclosed is an air pressure control (APC) device according to an embodiment of the inventive concept. The air pressure control (APC) device may include a processing chamber, a plate for adjusting a pressure in the processing chamber, and an APC valve including first and second step motors for adjusting a height of the plate, and an APC controller that controls the APC valve, and the APC controller may include a first controller that controls positions of the first step motor and the second step motor; and a second controller that compensates for a difference in position between the first step motor and the second step motor.

Air pressure control device

Disclosed herein is a heat exchanger for the recovery of waste heat. The heat exchanger includes: a bottom plate configured such that an exhaust gas inlet is formed therethrough; a top plate configured such that an exhaust gas outlet is formed therethrough at a location opposite that of the exhaust gas inlet; a first side plate configured such that a plurality first side through holes is formed therethrough; a second side plate configured such that a plurality of second side through holes is formed therethrough at locations opposite those of the first side through holes; a third side plate and a fourth side plate configured to connect the first side plate and the second side plate; and a plurality of heat exchange tubes formed as titanium material tubes, and configured to connect parallel between the first side through holes and the second side through holes.

Growing community of inventors

Gunpo-si, South Korea

In Kyu Park