Samsung Electronics Co., Ltd.

In-Kwon Kim

Kyung-Hyun Kim

Jong-Heun Lim

Ki-Jong Park

Ki-Ho Bae

Seung-Ho Park

Sang-won Bae

Hyo-san Lee

Sun-jae Jang

Woo-in Lee

A chemical mechanical polishing (CMP) apparatus includes a polishing pad on a polishing platen, a polishing head on the polishing pad, the polishing head having a membrane to hold a wafer on the polishing pad, and a polishing slurry feeding line to feed a polishing slurry, and a retainer ring around the membrane and in contact with the polishing pad to prevent detachment of the wafer, the retainer ring including a polishing slurry feeding inlet connected to the polishing slurry feeding line to feed the polishing slurry onto the polishing pad.

Chemical mechanical polishing apparatus for controlling polishing uniformity

A chemical mechanical polishing machine includes a polishing head assembly including a polishing head body and a membrane disposed at a bottom of the polishing head body. The bottom surface of the membrane includes a hydrophobic area and a hydrophilic area.

Chemical mechanical polishing machine and polishing head assembly

Growing community of inventors

Hwaseong-si, South Korea

In-Kwon Kim