Lg Innotek Co., Ltd.

In Kuk Cho

Eun Jin Kim

Chang Hwa Park

Jin Young Son

Kyoung Taek Park

Sang Soo Kwak

Disclosed are a lead frame and a method for manufacturing the same. The lead frame includes a copper substrate and a rough copper layer having surface roughness of 110 nm to 300 nm on a surface of the copper substrate.

Lead frame and manufacturing method thereof

A lead frame comprises: a base metal layer; a copper plating layer, including one of a copper layer and an alloy layer including a copper, configured to plate the based metal layer to make a surface roughness; and an upper plating layer, including at least one plating layer including at least one selected from the group of a nickel, a palladium, a gold, a silver, a nickel alloy, a palladium alloy, a gold alloy, and a silver alloy, configured to plate the copper plating layer.

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In Kuk Cho