Moda-innochips Co., Ltd.

Innochips Technology Co., Ltd.

Innochips Technology

Innochips Technologies Co., Ltd.

In Kil Park

Gyeong Tae Kim

Tae Hyung Noh

Jun Ho Jung

Seung Hun Cho

Ki Joung Nam

Jung Gyu Lee

Myung Ho Lee

Young Sul Kim

Song Yeon Lee

Sang Jun Park

Sung Il Park

Tae Geun Seo

Duk Hee Kim

Min Soo Lee

Jung Hun Lee

Hyun Chul Jung

Seung Hwan Lee

Soon Dong Choi

Ki Bum Kwon

In Seob Jung

Dae Kyum Kim

Sung Cheol Park

Seong Bae Park

Wan Park

Gyeong-Tae Kim

Euy Ho Shin

Byung Yul Choi

Hoi Kook Cheon

Hyun Mo Kang

Seong Cheol Park

Jin Hwan Kim

Hee Seob Shin

Ki Beom Kwon

Provided is a power inductor. The power inductor includes a body including metal powder and a polymer, at least one base provided in the body, and at least one coil pattern disposed on at least one surface of the base. The metal powder includes at least three metal powder of which middle values of grain-size distribution are different from each other.

Power inductor

Provided is a power inductor. The power inductor includes a body, at least one base material disposed within the body, at least one coil pattern disposed on at least one surface of the base material, an insulation layer disposed between the coil pattern and the body, and an external electrode disposed outside the body and connected to the coil pattern. The body includes a magnetic pulverized material and an insulation material.

Provided is a method of forming a coil pattern on at least one surface on a substrate, the method comprising forming a seed layer on at least one surface of a substrate, and forming at least two or more plating layers to cover the seed layer, wherein the two or more plating layers are formed through anisotropic plating.

Coil pattern, method for forming same, and chip device including same

Provided is a coil pattern formed on at least one surface of a substrate and including a first plating film formed on the substrate and a second plating film formed to cover the first plating film, a method of forming the coil pattern, and a chip device provided with the coil pattern.

Coil pattern and formation method therefor, and chip element having same

Provided is a power inductor. The power inductor includes a body, at least one base material disposed within the body, at least one coil pattern disposed on at least one surface of the base material, an insulation film disposed between the coil pattern and the body, and an external electrode disposed outside the body and connected to the coil pattern. The body includes a plurality of magnetic layers and insulation layers, which are alternately laminated.

In accordance with an exemplary embodiment, a power inductor includes a body, a base disposed in the body, and a coil pattern disposed on at least one surface of the base, in which the body includes metal powder, a polymer, and a thermal conductive filler and the base is formed by bonding a copper foil to both surfaces of a metal plate comprising iron.

The present invention suggests a power inductor comprising: a body; at least one substrate provided on the inside of the body; at least one coil pattern provided on at least one surface of the substrate; and an insulating layer formed between the coil pattern and the body, wherein at least a part of the substrate is removed and the body is filled in a region where the substrate is removed.

The present disclosure provides a power inductor, which includes a body, at least one substrate provided inside the body, at least one coil pattern provided on at least one surface of the substrate, and an insulation layer formed between the coil pattern and the body, wherein the insulation layer is formed of parylene.

In accordance with an exemplary embodiment, a power inductor includes a body, at least two bases disposed in the body, a plurality of coil patterns disposed on at least one surface of the at least two the base, respectively, and a connection electrode disposed on an outer portion of the body and connecting the at least two coils to each other.

Provided are a power inductor including a body, a base disposed in the body, a coil disposed on the base, a first external electrode connected to the coil, the first external electrode being disposed on a side surface of the body, and a second external electrode connected to the first external electrode, the second external electrode being disposed on a bottom surface of the body and a method for manufacturing the same.

Power inductor and method for manufacturing the same

Provided is a laminated chip device including a first laminate in which a plurality of conductor patterns formed on a plurality of sheets are connected to each other through a via formed to penetrate at least a sheet, and a second laminate provided over or below the first laminate and having a plurality of internal electrode patterns formed on a plurality of sheets, and the internal electrode patterns have a non-conductive region in at least a portion of an area corresponding to the via.

Laminated chip device

The present disclosure includes: a laminate in which a plurality of sheets are laminated; two or more noise filters provided spaced apart by a predetermined distance from each other in the laminate and respectively provided with a plurality of coil patterns; an external electrode provided outside the laminate and connected to the two or more noise filters; and a connection electrode provided outside the laminate being spaced apart from the external electrode to connect the two or more coil patterns.

Circuit protection device having noise filters

Provided is a piezoelectric vibrating device including a case provided with a certain space therein, a piezoelectric vibrating member provided in the case and vibrating according to an applied voltage, a weight member provided in the case and connected to a part of the piezoelectric vibrating member in a vibration direction of the piezoelectric vibrating member, and a limitation member for limiting movement of the weight member.

Piezoelectric vibrating device

Disclosed is a portable piezoelectric speaker including a body configured to be coupled to and separated from a rear surface of an electronic device, and a piezoelectric speaker module coupled to a predetermined area of the body, wherein the piezoelectric speaker module includes a piezoelectric device, and a vibration transfer member provided to be in contact with at least one area of the piezoelectric device and to be spaced apart from at least one surface of the piezoelectric device.

Portable piezoelectric speaker and electronic device having the same

Provided are a complex device including a piezoelectric device, a wire patch cell (WPC) antenna disposed on one surface of the piezoelectric device, the WPC antenna being connected to two antenna patterns that are vertically spaced apart from each other, and a near field communication (NFC) antenna disposed outside the WPC antenna and an electronic device having the same.

Growing community of inventors

Seongnam-si, South Korea

In Kil Park