Samsung Electronics Co., Ltd.

In-joon Yeo

Tae-hyuk Ahn

Kwang-Wook Lee

Jeong-Sic Jeon

Jung-woo Seo

Yong-Sun Ko

Kyung-Hyun Kim

Byoung-Moon Yoon

In-Seak Hwang

Dae-Hyuk Chung

Il-sang Lee

Kang-youn Lee

An electronic device may include a substrate and a plurality of conductive electrodes on the substrate. Each of the conductive electrodes may have a respective electrode wall extending away from the substrate, and an electrode wall of at least one of the conductive electrodes may include a recessed portion. In addition, an insulating layer may be provided on the electrode wall, and portions of the electrode wall may be free of the insulating layer between the substrate and the insulating layer.

Electronic devices including electrode walls with insulating layers thereon

An electronic device may include a substrate, a conductive layer on the substrate, and an insulating spacer. The conductive electrode may have an electrode wall extending away from the substrate. The insulating spacer may be provided on the electrode wall with portions of the electrode wall being free of the insulating spacer between the substrate and the insulating spacer, and portions of the electrode most distant from the substrate may be free of the insulating spacer. Related methods and structures are also discussed.

Methods of forming electronic devices including electrodes with insulating spacers thereon

A substrate cleaning device comprises a chamber for cleaning a substrate; a substrate support installed in the chamber providing a surface for supporting the substrate during cleaning thereof; at least one cleaning solution supply outlet for spraying a cleaning solution onto a surface of the substrate; a vibration force generator for supplying a vibratory action; a vibration force generating shaft which receives said vibratory action from the vibration force generator so that said vibration force generating shaft vibrates for agitating the cleaning solution on the substrate; and a vibration force distributor for preventing a vibration force from being concentrated on a portion of the substrate below the vibration force generating shaft.

Substrate cleaning device

Wafer cleaning apparatus include a cleaning tub configured to receive a wafer to be cleaned. A wafer cleaning unit coupled to the cleaning tub is configured to provide wafer cleaning solution to the wafer. A probe is positioned in the cleaning tub proximate the wafer. The probe is configured to provide megasonic vibrational energy to a surface of the wafer and/or the wafer cleaning solution to separate contaminants from the surface of the wafer. A probe cleaning unit is configured to provide a probe cleaning solution to the probe to clean the probe. Methods of using the wafer cleaning apparatus are also provided.

Wafer cleaning apparatus with probe cleaning and methods of using the same

An electronic device may include a substrate, a conductive layer on the substrate, and an insulating spacer. The conductive electrode may have an electrode wall extending away from the substrate. The insulating spacer may be provided on the electrode wall with portions of the electrode wall being free of the insulating spacer between the substrate and the insulating spacer. Related methods and structures are also discussed.

Electronic devices including electrodes with insulating spacers thereon

Cleaning solutions for integrated circuit devices and methods of cleaning integrated circuit devices using the same are disclosed. The cleaning solution includes about 30% aqueous ammonia solution, acetic acid by a volume percent higher then a volume percent of the aqueous ammonia solution, and deionized water by a volume percent higher then the volume percent of the acetic acid. Additionally, disclosed are methods wherein the cleaning solution is formed on integrated circuit substrates having an exposed metal pattern formed thereon, and further providing mega-sonic energy to the film of the cleaning solution.

Cleaning solution including aqueous ammonia solution, acetic acid and deionized water for integrated circuit devices and methods of cleaning integrated circuit devices using the same

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Gyeonggi-do, South Korea

In-joon Yeo