Samsung Electronics Co., Ltd.

Cheil Industries Inc.

Samsung Sdi Co., Inc.

Moatech Co., Ltd

In-Jae Lee

Gwang-Man Lim

Seok-Jae Han

Il-Mok Kang

Ki-Woong Yoo

Gyu-Seok Han

Ji-Young Jeong

Jee-Hyun Ryu

Jae-Hyun Kim

Ji-Yun Kwon

Seung-Jib Choi

Ju-Ho Jung

Dong-Wan Kim

Seok-heon Lee

Jae-bum Lee

Nam-Gwang Kim

Seung-Yong Shin

Sang Sub Song

Ji-Hong Kim

Jae-Phill Kong

Do-Hyung Kim

Sun-Tae Jung

Min-Woo Kim

Yu-Jin Lee

Hwan-Sung Cheon

Tae-Woon Cha

Shahrokh Motallebi

Oh-Dal Kwon

Seung-Joo Shin

Shin-Jae Kang

Jeon-Il Lee

Sang-Won Cho

Kyung-Hee Hyung

Jeong-Hwan Song

Dong-Hoon Han

Sung-Woong Kim

Se-Young Choi

Seong-Kwan Oh

Bang-weon Lee

Hyun-Ki Yang

Ki-Hong Jeong

Yeon-Soo Lee

Seung-Wan Lee

Soo-Young Heo

Jin-Ki Hong

Hyuk-Sang Ahn

Han-Chul Hwang

Ki-Hwan Hong

Sun-Hee Jin

Mi-Jin Choi

Chae-mook Lim

Chang-Ryul Lee

Kevin Bae

Kyung-Wook Park

Plueg Carsten

Ji-Hyun Hwang

Seung Wan Koh

Ji-Hye Kwon

Min-Kyeol Chung

Dong-Won Song

Jong-Seung Park

Kyong-Shik Lee

Myong-Won Kim

Joon-Yong Cho

Youngdong Kim

Sun-Soo Lee

A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, the semiconductor chip including a logic chip and a memory stack structure on the logic chip, a connector and a connector terminal below the package substrate, a molding layer that covers the semiconductor chip, the molding layer having a recess region on a top surface of the molding layer, a housing that covers the molding layer, and an air gap on the semiconductor chip, the air gap being defined by the housing and the recess region of the molding layer, and the molding layer separating the air gap from the memory stack structure of the semiconductor chip.

Semiconductor package with recessed molding region disposed below housing and above semiconductor chip

In a layer deposition method, a substrate is loaded into a process chamber. A gas filling tank is charged with a gas to a predetermined charge pressure. The pressure of the gas is elevated to a pressure greater than the predetermined charge pressure. The gas is introduced into the process chamber.

Layer deposition method and layer deposition apparatus

A card-type solid state drive (SSD) including: a substrate that has a first surface and a second surface facing each other; a memory controller and a nonvolatile memory device that are on the first surface; a plurality of functional terminals on the second surface; and a plurality of thermal terminals on the second surface, wherein the functional terminals include first-row functional terminals, second-row functional terminals, and third-row functional terminals, wherein at least one of the first-row functional terminals, at least one of the second-row functional terminals, and at least one of the third-row functional terminals are electrically connected to the memory controller or the nonvolatile memory device, and wherein the thermal terminals are not electrically connected to the memory controller or the nonvolatile memory device.

Card-type solid state drive

An electric apparatus includes a substrate having a ground pattern on a top surface of the substrate; a conductive housing on the ground pattern and having an insertion space; a conductive connector disposed between the ground pattern and the conductive housing and connected to the ground pattern and the conductive housing, wherein the conductive housing is fixed to the substrate via the conductive connector; and a conductive cover coupled to the conductive housing, wherein the conductive cover is configured to move from a first position, at which the conductive cover externally opens the insertion space, to a second position, at which the conductive cover closes the insertion space.

Memory card socket and electronic apparatus

A memory card includes a first ground terminal arranged in a first row that provides a ground voltage to at least one nonvolatile memory or a memory controller, universal flash storage (UFS) terminals arranged in a second row including a first UFS terminal that provides a second power, a second UFS terminal that provides a reference clock signal, and a third UFS terminal that provides a path for input/output data to the memory controller, and a first power terminal arranged in a third row that provides a first power supply voltage (VCC) to the at least one nonvolatile memory or the memory controller. The memory card has a size defined by a nano subscriber identification module (SIM) card standard, the first ground terminal corresponds to a 'C' terminal of the nano SIM card standard, and the first power terminal corresponds to a 'C' terminal of the nano SIM card standard.

Universal flash storage memory card

Disclosed are a photosensitive resin composition for a color filter including (A) a colorant including a dye; (B) a photocurable dispersing agent; (C) an acrylic-based binder resin; (D) a photopolymerizable monomer; (E) a photopolymerization initiator; and (F) a solvent, and a color filter using the same.

Photosensitive resin composition and color filter using the same

A photosensitive resin composition for a color filter includes (A) a yellow or orange dye; (B) a dye combination of a cyanine dye represented by the following Chemical Formula 1, wherein in Chemical Formula 1, each substituent is the same as described in the detailed description, and a metal complex dye; (C) an acrylic-based binder resin; (D) a photopolymerizable monomer; (E) a photopolymerization initiator; and (F) a solvent, and a color filter using the same. 

Photosensitive resin composition for color filter and color filter using the same

Disclosed are a photosensitive resin composition for a color filter that includes (A) a colorant including a cyanine dye represented by the following Chemical Formula 1, (B) an acrylic-based binder resin, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a solvent, and a color filter using the same.  In the above Chemical Formula 1, each substituent is the same as described in the detailed description.

Memory card

Disclosed are a photosensitive resin composition for a color filter including (A) a colorant including a compound represented by Chemical Formula 1 and/or a compound including repeating units represented by Chemical Formula 2 and Chemical Formula 3, wherein Chemical Formula 1, Chemical Formula 2, and Chemical Formula 3 are the same as defined in the specification; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent, and a color filter using the same.

Disclosed are a photosensitive resin composition including (A) a colorant including a compound represented by the following Chemical Formula 1 and Chemical Formula 2, wherein in Formulae 1 and 2, each substituent is the same as defined in the detailed description; (B) an acrylic-based binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent, and a color filter using the same. 

The invention relates to a vibration generator which is used in devices, such as mobile phones, requiring a vibration mode. More specifically, the invention relates to a horizontal vibration type vibration generator which includes a casing that is open on one surface thereof, a vibration part having a weight provided inside the casing, and a spring mounted inside the casing, and which produces horizontal vibration by using the phenomenon of resonance which occurs by causing oscillation in an electromagnetic force having the same frequency as the intrinsic vibration frequency of the spring, and which solves the problem of a reduction in the life span of the vibration generator due to mechanical friction as seen in existing mechanical vibration generators, and generates a large vibration force despite having a thin construction unachievable in a vertical moving type vibration generator. The invention also relates to a production method of the vibration generator.

Vibrator for generating horizontal vibration

Growing community of inventors

Uiwang-si, South Korea

In-Jae Lee