Samsung Electro-mechanics Co., Ltd.

In Jae Chung

Hyun Seok Yang

Mi Jeong Jeon

Sangik Cho

Jong Eun Park

Hiroki Okada

Chan Jin Park

Young Ook Cho

Tae Hee Yoo

A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.

Method of manufacturing printed circuit board

A method of manufacturing a printed circuit board includes: forming first and second resist films, respectively having first and second openings exposing a first metal layer disposed on one surface of an insulating layer; forming a second metal layer on the first metal layer, exposed through the first and second openings, to fill at least a portion of each of the first and second openings; and removing the first and second resist films. The first and second openings have different widths in a cross-section.

Printed circuit board and method for manufacturing the same

Growing community of inventors

Suwon-si, South Korea

In Jae Chung