Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Industry-University Cooperation Foundation Hanyang University

Shinil Chemical Industry Co., Ltd.

Robert Boschgmbh

Samsung Sdi Co., Inc.

Iucf-hyu

Dds Company

In Gun Kim

Yong Joo Jo

Sang-Won Byun

Kyeong Pang

Yu-dong Bae

Ju Sung Park

Young-hyun Kim

Phil Ho Jung

Ga Young An

Dong Shin Yang

Sot Eum Seo

Ju Hwa Son

Kyung-yol Yon

Jonghoon Won

Byung-kwon Kang

Eun-Hwa Lee

Junghoon Lee

Feifei Fang

Hyoungwoo Choi

Jinwoo Lee

Ji Young Lee

Dukjung Kim

Jae-Ik Kwon

Duk-Jung Kim

Chi-Young Lee

Zin Min Park

Moo Ho Lee

In-kuk Yun

Sang-moon Lee

Byeong-Hoon Park

Min Jae Kim

Seok Hoon Kim

Soo-Seok Choi

Won Cheol Jung

Young Suk Kang

Young-ki Kim

Hyung-Sik Kim

Jung-Kee Lee

Jae-Kyung Kim

Da-hye Park

Young Jae Park

Joongheon Kim

Sin-Ae Kim

Ju Hwan Lee

Seung Min Shin

Joungeun Yoo

Changho Noh

Yeon Kyoung Jung

Joong-Heon Kim

Song Won Hyun

In Su Lee

Hye Jeong Lee

Ginam Kim

In Ki Kim

Mooho Lee

Moon Il Jung

Yong Jun Choi

Ji Hoon Cha

Yu-Dong Bae

Sang-deok Kim

Won-Jun Lee

Hong-Hyeon Lee

Ki-won Seok

Hyo Won Sin

Ju Seop Lee

In-Kuk Yun

Byung Hwa Seo

Jeong-Jun Kim

Un Seob Sim

Sung Dug Kim

Keum Suk Seo

Young-Churl Bang

Byung-Ok Jeon

Hyun Seok Hong

Songwon Hyun

Dahye Park

Eun-Jung Kim

Sang-eun Shim

Pil Gu Kwon

Jung Bon Moon

Seon Yeong Kim

Hyejeong Lee

Kyeon Pang

Jongbum Lee

Insu Lee

Youngeun Kim

Eunjung Kim

Sangwoon Yang

Hyung-sik Kim

Kung-don Han

Manwar Hussain

Pil Joong Yoon

Je Sung Kim

Sang Un Kim

Jaekyung Kim

Tae Hoon Kim

Myung Su Park

An amine-based curing agent including a compound represented by Chemical Formula 1, and a composition including the curing agent, and a semiconductor package, and an electronic device prepared with the composition. The definition of Chemical Formula 1 is as described in the detailed description.

Amine-based curing agents, and compositions, semiconductor packages, and electronic devices including the same

The present disclosure relates to a printed circuit board including a first insulating layer including a non-photosensitive insulating material, a first wiring layer embedded in the first insulating layer, where an upper surface thereof is exposed from the upper surface of the first insulating layer, includes a first metal layer, and a second metal layer covering at least a portion of each of the lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer, and a second insulating layer disposed under the lower surface of the first insulating layer to cover at least a portion of a lower surface of the first wiring layer, and including the non-photosensitive insulating material.

Printed circuit board

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system; and a spacer disposed between the sixth and seventh lenses, wherein the optical imaging system satisfies 0.5<S6d/f<1.4, where S6d is an inner diameter of the spacer, f is an overall focal length of the optical imaging system, and S6d and f are expressed in a same unit of measurement.

Optical imaging system

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially arranged along an optical axis from an object side toward an image side. The fifth lens has a positive refractive power, a focal length of the fifth lens is smaller than an overall focal length of the optical imaging system, and −0.38≤R10/f≤−0.32, where R10 is a radius of curvature of an image-side surface of the fifth lens and f is the overall focal length of the optical imaging system.

A spacer includes an outer circumferential surface in contact with a lens barrel, and an inner circumferential surface forming a hole for controlling an amount of light, a first length of the hole in a first direction, intersecting an optical axis, and a second length of the hole in a second direction, intersecting the optical axis, are different from each other, and a first distance from the outer circumferential surface to the inner circumferential surface, extended in the first direction, is less than a second distance from the outer circumferential surface to the inner circumferential surface, extended in the second direction.

Spacer and camera module

A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.E1-M1-L1-M2-L2-M3-L3-A-L3-M3-L2-M2-L1-M1-E2  Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.

High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same

A composite including a polymer matrix; an inorganic moisture absorber; a ceramic filler, graphite, or a combination thereof; and a tracking resistance polymer, wherein the tracking resistance polymer includes an average bond energy between an atom forming a main chain and another atom covalently bonded to the atom that forms the main chain of about 350 kJ/mol to about 500 kJ/mol; a carbonaceous residue yield after pyrolysis of less than or equal to about 5 weight percent, based on the amount of the tracking resistance polymer before pyrolysis; or a combination thereof.

Battery case and battery

A camera module includes: a lens module including a plurality of lenses; a housing accommodating the lens module; a reflective member disposed in front of the lens module; an image sensor module to receive light passing through the lens module; and a first light shielding plate disposed in the housing in a space between the lens module and the image sensor module.

Camera module

An epoxy compound including a 5-membered aromatic heterocyclic ring represented by Formula 1 or Formula 2, a composition prepared using the epoxy compound, a semiconductor device prepared using the epoxy compound, an electronic device prepared using the epoxy compound, an article prepared using the epoxy compound, and a method of preparing the article:E1-(M1)-(L1)-M3-(L2)-(M2)-E2&#x2003;&#x2003;Formula 1E1-(M1)-(L1)-M3-(L2)-(M2)-(L5)-A-(L6)-(M4)-(L3)-M6-(L4)-(M5)-E2&#x2003;&#x2003;Formula 2

Epoxy compound, composition prepared therefrom, semiconductor device prepared therefrom, electronic device prepared therefrom, article prepared therefrom, and method of preparing article

A lens assembly includes a lens including an optical portion to refract light and a flange portion extended along a periphery of at least a portion of the optical portion, and a lens barrel to accommodate the lens. The flange portion has a non-circular shape and includes a first di-cut portion on a first side surface of the flange portion, a second di-cut portion on a second side surface of the flange portion, and arc portions connecting the first di-cut portion and the second di-cut portion. A first distance between the first di-cut portion and an optical axis of the lens and a second distance between the second di-cut portion and the optical axis of the lens are smaller than a distance between respective opposite ends of the arc portions and the optical axis.

Lens assembly

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system; and a spacer disposed between the sixth and seventh lenses, wherein the optical imaging system satisfies 0.5&#x3c;S6d/f&#x3c;1.4, where S6d is an inner diameter of the spacer, f is an overall focal length of the optical imaging system, and S6d and f are expressed in a same unit of measurement.

An apparatus is provided. The apparatus includes a spinner configured to hold a wafer, a nozzle configured to supply a liquid chemical onto an upper surface of the wafer, and a laser module configured to heat the wafer by radiating a laser beam to a lower surface of the wafer while the nozzle supplies the liquid chemical onto the upper surface of the wafer.

Semiconductor device manufacturing apparatus including laser module

Growing community of inventors

Suwon-si, South Korea

In Gun Kim