Samsung Electronics Co., Ltd.

Plan Co., Ltd

Other

In Cheol Lee

Kilsoo Kim

Chul Won Park

Disclosed is a system for treating exhaust fluid from semiconductor manufacturing equipment in which cleaning gases decomposed by a plastic apparatus alternately flow towards a front rotor region (a main rotor unit) and a rear rotor region (a subsidiary rotor unit) of a booster pump and then flow towards a dry pump, and thus uniformly react with process byproducts present throughout the whole area in a vacuum pump including the booster pump and the dry pump so as to improve removal efficiency of the process byproducts. Further, the retention time of the cleaning gases decomposed by the plasma apparatus in the vacuum pump is increased by adjusting the pressure in the pump with the rotational speed of a motor, and thus the reaction time of the cleaning gases with the process byproducts is increased, so as to further improve removal efficiency of the process byproducts, such as SiOpowder.

System and method for treating exhaust fluid from semiconductor manufacturing equipment

Disclosed is a pump system for a semiconductor chamber includes a housing having a front chamber and a rear chamber, a roots-type rotor provided to the front chamber of the housing, a screw-type rotor provided to the rear chamber, a shaft member coupled through the roots-type rotor and the screw-type rotor, and a driving motor provided to the outside of the housing in such a way as to be axially connected to the shaft member to provide power for driving the rotors. A fluid pipe is provided to the outside of the housing to connect the front chamber and the rear chamber. The fluid pipe is provided with a heater and/or a cooler to heat or cool the fluid flowing through the fluid pipe.

Pump system for semiconductor chamber

The present invention relates to a technology of efficiently cooling a vacuum pump that produces a vacuum in a process chamber of a semiconductor manufacturing facility. The present invention provides a new type of vacuum pump cooling method that keeps the internal temperature of a vacuum pump at a predetermined level by circulating oil through rotors of the vacuum pump, such that it is possible to prevent a rapid increase in the temperature of the vacuum pump and smoothly lubricate bearings at the early stage of operation, whereby it is possible to ensure stability when performing processes and operating the pump and economically maintain the facility.

Vacuum pump with cooling apparatus

A semiconductor package comprises a package substrate; a first chip stack and a second chip stack mounted side by side on the package substrate, wherein the first and second chip stacks each include a plurality of semiconductor chips stacked on the package substrate, wherein each of the semiconductor chips includes a plurality of bonding pads provided on a respective edge region thereof, wherein at least some of the plurality of bonding pads are functional pads, and wherein the functional pads occupy a region that is substantially less than an entirety of the respective edge region.

Semiconductor package including stepwise stacked chips

A semiconductor package and a method of fabricating the same are provided. The semiconductor package may include a first semiconductor chip with a first circuit pattern, a second semiconductor chip disposed on the first semiconductor chip and provided with a second circuit pattern, and first and second connection structures penetrating the first and second semiconductor chips. The first connection structure may be electrically connected to the first circuit pattern and may be electrically disconnected from the second circuit pattern. The second connection structure may be electrically disconnected from the first circuit pattern and may be electrically connected to the second circuit pattern.

Semiconductor packages and fabrication method thereof

A semiconductor package includes one or more semiconductor stack structures mounted on a package board. The semiconductor stack structures include sequentially stacked first to fourth semiconductor devices. Each of the first to fourth semiconductor devices includes a first unit semiconductor chip and a second unit semiconductor chip. The first unit semiconductor chip and the second unit semiconductor chip are unitary. A method for fabricating the semiconductor package includes forming pairs of unit semiconductor chips on a wafer, forming a scribe lane between the pairs of unit semiconductor chips, separating the pairs of unit semiconductor chips into semiconductor devices, each of the semiconductor devices having a corresponding one pair of unit semiconductor chips.

Semiconductor package having unified semiconductor chips

A wiring board and a semiconductor package are provided. The wiring board includes: a metal core including a first surface and a second surface opposite the first surface; a first buildup portion and a second buildup portion including an insulating layer and a pad pattern sequentially stacked, the first and second buildup portions being provided on the first surface and the second surface, respectively; a mask pattern including an opening exposing the pad pattern, the mask pattern being provided on the second buildup portion; and a barrier pattern in an area in which a region of the metal core which overlaps with the pad pattern of the second buildup portion is removed, wherein a minimum width of an outer circumference of the barrier pattern is greater than a maximum width of the pad pattern of the second buildup portion.

Growing community of inventors

Hwaseong-si, South Korea

In Cheol Lee