Gennum Corporation

Imran Sherazi

Stephen Joseph Kovacic

A direct attach optical receiver module and a system and method for testing the direct attach optical receiver module are provided. An optical receiver module may include an optical detector and an integrated circuit with an integrated amplifier circuit and at least one integrated capacitor. In one example, the optical detector may be physically attached to the integrated circuit and the output port of the optical detector may be electrically coupled to the input port of the integrated circuit. In another example, a redistribution layer that includes a tuning inductor may be being physically attached between the optical detector and the integrated circuit.

Direct attach optical receiver module and method of testing

Optical receiver modules are used for receiving high-speed optical data signals. Unfortunately, these optical receiver modules are often tested for the first time after they are packaged in a housing. Thus significant costs are associated with those packaged devices that fail to meet predetermined criteria. An integrated optical receiver module is proposed that has an optical detector direct attached, or flip-chipped or bumped, onto an integrated circuit having an amplifier circuit. The direct attach process is performed when the integrated circuits still reside on a semiconductor wafer prior to dicing thereof. Thus, high speed optical testing of the optical receiver module is possible on a wafer level to determine actual performance characteristics thereof prior to dicing.

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Ottawa, Canada

Imran Sherazi