Aurora Operations, Inc.

Imbert Yuyen Wang

Sen Lin

Andrew Steil Michaels

Pruthvi Jujjavarapu

James Ferrara

Parth Panchal

Gevorg Martuni Nahapetian

The present disclosure is directed to a manufacturing process for a LIDAR system with individualized semiconductor optical amplifier (SOA) dies including: (a) forming a plurality of SOA regions on a semiconductor wafer; (b) dicing the semiconductor wafer to produce a plurality of individualized SOA dies, the plurality of individualized SOA dies respectively including the plurality of SOA regions; (c) aligning the plurality of individualized SOA dies with one or more array inputs, the one or more array inputs configured to provide a beam from a light source to the plurality of individualized SOA dies; and (d) aligning the plurality of individualized SOA dies with one or more array outputs, the one or more array outputs configured to provide the beam from the plurality of individual SOA dies to an emitter.

Manufacturing process for LIDAR system with individualized semiconductor optical amplifier dies

A LIDAR system for a vehicle can include a receiver die having one or more light sensitive components and one or more optical isolation trenches configured to optically isolate the one or more light sensitive components on the receiver die; wherein the one or more optical isolation trenches are arranged such that light does not pass in a direct path through the receiver die.

LIDAR sensor system with improved optical isolation features

Growing community of inventors

Santa Clara, CA, United States of America

Imbert Yuyen Wang