Lg Electronics Inc.

Ilyoong Park

Jaeyoul Lee

Changbong Choi

Manho Park

Miryoung Kang

Provided is a method of manufacturing a damper assembly. In the method, a case constituting an appearance of the damper assembly and having an open surface is molded, the case is inserted in a jig, the case is filled with a thermal insulating material to blow and mold the thermal insulating material, and a closing plate is coupled to the case to cover the open surface of the case. The closing plate contacts the discharge duct when the damper assembly closes the discharge duct. Accordingly, dimension stability, a defect rate, and sealing and insulating performances of the damper assembly are improved.

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Gyeongnam, South Korea

Ilyoong Park