Arch Specialty Chemicals, Inc.

Fujifilm Electronic Materials U.s.a., Inc.

Ilya Rushkin

Ahmad A Naiini

Richard Hopla

William D Weber

Pamela J Waterson

David B Powell

Donald W Racicot

Jon Metivier

Don Perry

Richard J Hopla

A positive photosensitive resin composition comprising:  

Photosensitive resin compositions

An end-capped polybenzoxazole precursor having acid labile functional groups, positive working photosensitive compositions thereof and use of the compositions for producing heat resistant relief images on substrates.

Positive photosensitive resin compositions

A heat resistant negative working photosensitive composition that comprises 

New photosensitive PBO precursor polymers which contain diazoquinone moieties attached to its backbone and in which all amino end groups are converted into amide groups. The photosensitive formulation based on the disclosed PBO precursor polymers have good imaging and mechanical properties as well as superior shelf life stability. Photosensitive polybenzoxazole precursor polymers having (sulfon)amide end groups (with or without attached diazoquinone groups) can be formulated into photosensitive compositions with diazoquinone photoactive compounds which lack benzylic hydrogens on the backbone to yield compositions producing films significantly lighter in color after curing.

Stable non-photosensitive polyimide precursor compositions with an adhesion promoter in a non-NMP solvent for use in forming high temperature resistant relief images and a process for making said images. The non-photosensitive polyimide precursor compositions comprise

Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems

A heat resistant negative working photosensitive composition that comprises

Growing community of inventors

Walpole, MA, United States of America

Ilya Rushkin