Delphi Technologies, Inc.

Coolit Systems, Inc.

Ilya Reyzin

Mohinder Singh Bhatti

Shrikant Mukund Joshi

Debashis Ghosh

Donald John Enzinna

Mark Joseph Parisi

Prasad Shripad Kadle

Edward Wolfe, Iv

James A Bright

John Lawrence Pawlak, Iii

David P Rusch

Stephan Michael Vetter

Lawrence P Scherer

Russell S Johnson

Andrew R Hayes

Susan Claire Vasko

Stephen Michael Vetter

Kurt Dale Hollasch

Edward Wolfe Iv

An air conditioning system including an evaporator having a manifold and a plurality of tubes extending downward in a vertical direction from the manifold. The evaporator defines at least one PCM tank engaging the manifold for storing a phase change material. When operating in a first operating mode, heat is transferred from the phase change material to the refrigerant to freeze and cool the phase change material. When operating in a second operating mode, heat is transferred from the refrigerant to the frozen phase change material to condense the refrigerant. The condensed refrigerant falls downwardly through the tubes and receives heat from a flow of air to cool the air and evaporate the refrigerant. The evaporated refrigerant rises upwardly back to the low pressure of the cold manifold.

Evaporator phase change thermal siphon

An integrated liquid cooling unit comprising a liquid pump and a U-shaped flat tube. An adapter rigidly connects and establishes fluid communication between the pump and the tube creating an integrated unit for cooling an electronic chip via a closed loop. Heat is rejected from the coolant through cooling fins disposed between the legs of the U-shaped tube to passing air being propelled by a blower assembly.

Integrated liquid cooling unit for computers

The invention provides for an orientation insensitive heat exchanger assembly for cooling an electronic device comprising a hermetically sealed housing defining a boiling chamber and two condensing chambers. A partition is disposed in the boiling chamber and defines two sets of alternating channels extending in overlapping relationship to one another and with one set of alternating channels open to one of the condensing chambers and the other set of alternating channels open to the other condensing chamber for sealing the condensing chambers from one another. Coolant is maintained in each of the condensing chambers. In operation, if the thermosiphon is tilted with one side lower than the other, the channels open to the lower side are empty of coolant into the lower condensing chamber while the channels open to the opposite upper side hold the coolant over the entire boiling chamber aligning with an electronic device to continue cooling.

Thermosiphon for laptop computers comprising a boiling chamber with a square wave partition

A heat exchanger having a plurality of tubes that define refrigerant passages extending vertically from a lower end to an upper end. A bottom header is in fluid communication with the passage at the lower end of the tube, and a top header is in fluid communication with the passage at the upper end of the tube. A plurality of plates extends rearwardly from the tubes to a distal edge. Adjacent plates extending from adjacent tubes are closed off at the distal edges by a connector, and adjacent plates extending from the same tube have a rear opening between the distal edges for receiving air into the assembly. A plurality of orifices is disposed along the plates to allow air from the rear opening to flow downstream between the tubes. A water tank and wicking material are provided for wetting the plates.

High efficiency evaporatively cooled condenser

The invention provides a heat exchanger assembly having a housing which defines a boiling chamber extending along an axis between opposite ends. A plurality of first condensing tubes extend axially and downwardly in one direction at a first predetermined angle to and below the axis (A) from the housing and a plurality of second condensing tubes extend axially and upwardly in the opposite direction at the same predetermined angle to and above the axis (A) from the housing. The volume of refrigerant in the housing is greater than the volume of the second condensing tubes and the volume of the boiling chamber.

Orientation insensitive thermosiphon capable of operation in upside down position

A refrigeration assembly includes a pair of refrigerated chambers defined within a working chamber. The refrigerated chambers include channel walls extending parallel to one another and spaced apart, and first and second panels extending channel walls to define a working channel for separating the working chamber into sub-chambers. Apertures defined in the panels allow airflow from the sub-chambers into the working channel, and a supply of water wets the panels and a first section of the refrigerated chambers. Air enters the sub-chambers and flows over the first sections of the refrigerated chambers for direct evaporative cooling. A portion of the air bleeds through the apertures and evaporates water from the panels prior to flowing over the second sections of the refrigerated chambers for indirect evaporative cooling.

Evaporative cooler

An automotive air conditioning system is disclosed comprising an evaporative cooler in series with the conventional vapor compression system. The evaporative cooler comprises an array of dry channels and a contiguous array of wet channels. The primary air stream to be conditioned by the evaporator of the conventional air conditioning system is preconditioned by the evaporative cooler by lowering its dry bulb temperature without changing its absolute humidity. An evaporator core is supported downstream of the evaporative cooler for receiving the primary air from the dry channels and thereby produces liquid condensate. The system is distinguished by conducting the liquid condensate from the evaporator core to the wicking tank for use in the wet channels of the evaporative cooler.

Evaporative cooler assisted automotive air conditioning system

A thermosiphon cooling assembly includes a plurality of hairpin condenser tubes that extend into openings of a boiling chamber for collection of refrigerant vapor from a boiler housing. The distal ends of the tubes extend into the chamber from a cover the least distance midway between the ends of the boiler housing and increase in distance in opposite directions toward the ends. The hairpin tubes are in groups with each tube in a group having the same length and the groups having respectively different lengths and at least one group includes more than one tube.

High performance compact thermosiphon with integrated boiler plate

An evaporatively pre-cooled seat assembly comprising a seat cushion, an auxiliary cooler, and an evaporative cooler. The evaporative cooler includes a plurality of parallel tubular dry channels and a plurality of tubular wet channels. The dry channels and wet channels are arranged such that they alternate from dry channel to wet channel from channel to channel. Each of the channels is defined by two parallel side walls, a top, and a bottom. A first plurality of dry channels defines a plurality of apertures in the side walls thereof for conveying air out of the respective dry channel and into an adjacent wet channel. A second plurality of dry channels alternates with the first plurality and is disposed between two wet channels and defines a plurality of cooler apertures in the tops thereof for conveying cooled air out of the second plurality of alternating dry channels and to the auxiliary cooler.

Evaporatively pre-cooled seat assembly

The invention provides a fluid heat exchange assembly comprising a housing containing a liquid refrigerant presenting a surface. A tube is coiled in adjacent coils around an axis parallel to the surface of the liquid refrigerant with a first sector of each coil disposed below the liquid surface and a second sector of each coil disposed above the liquid surface whereby said tube runs into and out of said liquid refrigerant.

Liquid cooled thermosiphon with condenser coil running in and out of liquid refrigerant

A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. A continuous sheet extends in v-shaped fins between and engaging said arcs of said chambers. The internal fins extend from a center axis of the tube to reverse bends defining the opposite ends of the tube. A continuous sheet extending in sinuous corrugations extends around the exterior of the endless loop between opposite sides of a heat transfer area, which receives the electronic element.

Thermosiphon for laptop computer

A heat exchanger assembly is provided including a primary housing having a plurality of primary condensing fingers extending upwardly from and perpendicular to a horizontal axis and disposed circumferentially about a primary axis. A tube extends radially from the primary axis along the horizontal axis toward a remote housing including remote condensing fingers extending downwardly from and perpendicular to the horizontal axis. The remote condensing fingers are disposed circumferentially about a remote axis extending vertically through the remote housing. The tube interconnects the primary housing and the remote housing and is flexible to facilitate movement of the housings relative to one another.

Orientation insensitive compact thermosiphon with a remote auxiliary condenser

A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).

Heat dissipation element for cooling electronic devices

A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divides the upper portion of the housing from the lower portion and flow interrupters are disposed in the upper portion for interrupting thermal boundary layer to enhance thermal heat transfer to the flow of liquid coolant through the coolant passage of the upper portion in response to heat transferred by an electronic device to the lower portion of the housing.

Liquid cooled thermosiphon for electronic components

A heat exchanger assembly is provided including a multi-function boiling chamber having a top wall and a bottom wall parallel to the top wall and a first side wall and a second side wall both extending inwardly from the bottom wall to the top wall and a pair of end walls closing the chamber. First and second condensing tubes attached to the first and second side walls, respectively, of the boiling chamber have an elongated width presenting an upper surface and a lower surface and extend in opposite respective directions to distal ends of the tubes at an inclined angle relative to the bottom wall of the boiling chamber. The condensing tubes include a plurality of channels across the width and extending from the boiling chamber to the distal end of the tube. A tank disposed at each of the distal ends of the condensing tubes is in fluid communication with the channels tubes. Upper air fins extending upwardly in a plane containing the top wall of the boiling chamber and lower air fins extending downwardly in a plane containing the bottom wall of the boiling chamber engage the respective upper and lower surfaces of both condensing tubes between the respective side walls of the boiling chamber and a position adjacent the respective distal ends of the condensing tubes.

Growing community of inventors

Williamsville, NY, United States of America

Ilya Reyzin