Asml Netherlands B.v.

Ilya Malakhovsky

Richard Johannes Franciscus Van Haren

Leon Paul Van Dijk

Ronald Henricus Johannes Otten

Raymond Wilhelmus Louis Lafarre

Johannes Petrus Martinus Bernardus Vermeulen

Siegfried Alexander Tromp

Derk Servatius Gertruda Brouns

Pieter Renaat Maria Hennus

Amandev Singh

Satish Achanta

Edward Hage

Tiannan Guan

Johannes Charles Adrianus Van Den Berg

Bas Johannes Petrus Roset

Ludolf Postma

Mahdi Sadeghinia

Joffrey Rene Sylvian Craquelin

Jan Willem Adriaan Oosterling

Marcel Duco Snel

Wouter Van Der Chijs

Bartel Joris Van Der Veek

Mike Johannes Antonius Van Kuijk

Subodh Singh

Marina Antoinetta Leonarda Van Uum-van Herk

Henricus Marinus Theodorus Wiersma

An object handling apparatus for handling a generally planar object, the object handling apparatus including: two support arms, at least one of the two support arms movable relative to another support arm generally in a plane such that the two support arms are operable to grip and hold an object disposed in the plane, wherein each of the support arms includes at least one support pad and at least one aligner, the support pads configured to locally contact a surface of the object and apply a force thereto generally perpendicular to the plane so as to support the object and the at least one aligner configured to locally contact a surface of the object and apply a force thereto generally in the plane so as to grip the object.

Apparatus for assembly of a reticle assembly

A method and control system for determining stress in a substrate. The method includes determining a measured position difference between a measured position of at least one first feature and a measured position of at least one second feature which have been applied on a substrate, and determining local stress in the substrate from the measured position difference.

Methods of determining stress in a substrate, control system for controlling a lithographic process, lithographic apparatus and computer program product

Methods and apparatuses for determining in-plane distortion (IPD) across a substrate having a plurality of patterned regions. A method includes obtaining intra-region data indicative of a local stress distribution across one of the plurality of patterned regions; determining, based on the intra-region data, inter-region data indicative of a global stress distribution across the substrate; and determining, based on the inter-region data, the IPD across the substrate.

Metrology apparatus

Methods and associated apparatus for reconstructing a free-form geometry of a substrate, the method including: positioning the substrate on a substrate holder configured to retain the substrate under a retaining force that deforms the substrate from its free-form geometry; measuring a height map of the deformed substrate; and reconstructing the free-form geometry of the deformed substrate based on an expected deformation of the substrate by the retaining force and the measured height map.

Methods and apparatus for use in a device manufacturing method

A substrate table to support a substrate, the substrate table including a main body, burls extending from the main body and having first upper ends that define a support surface to support the substrate, and support pins having second upper ends. The support pins are movable between a retracted position and an extended position. The support pins are arranged to support the substrate in the extended position. The support pins are arranged to be switched to a first stiffness mode and a second stiffness mode. In the first stiffness mode, the support pins have a first stiffness in a direction parallel to the support surface. In the second stiffness mode, the support pins have a second stiffness in the direction parallel to the support surface. The first stiffness is different from the second stiffness.

Substrate table and lithographic apparatus

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Eindhoven, Netherlands

Ilya Malakhovsky