Samsung Electronics Co., Ltd.

Ilsun Yoon

Bongsu Shin

Joonyong Park

Sunghoon Lee

Jaeseung Chung

Jihyun Bae

Dongouk Kim

Sukgyu Hahm

Jong G Ok

A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.

Method of transferring reverse pattern by using imprint process

A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.

Master wafer, method of manufacturing the same, and method of manufacturing optical device by using the same

A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.

Method of forming aligned pattern in pattern formation region by using imprint process

A pattern structure includes a plurality of pattern structure units arranged substantially on a same plane, where each of the pattern structure units has a first surface and a second surface, which are opposite to each other, and a microstructure is defined on the first surface of each of the pattern structure units, and a flattening layer disposed on the second surface of each of the plurality of pattern structure units, where the flattening layer connects the pattern structure units with each other, and a vertical step difference exists between second surfaces of the pattern structure units.

Pattern structure and method of manufacturing the pattern structure

A pattern structure includes a plurality of pattern structure units arranged on a same plane, where each of the plurality of pattern structure units includes a plurality of microstructures defined on a surface thereof and having a width of less than about 1 micrometer (&#x3bc;m); and a connection layer disposed between the plurality of pattern structure units and having a width of less than about 10 &#x3bc;m, where the connection layer connects the plurality of pattern structure units to each other.

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Seongnam-si, South Korea

Ilsun Yoon