Samsung Electronics Co., Ltd.

Ilsoo Kim

Heeyoub Kang

Young-rok Oh

Kitaek Lee

Hwi-jong Yoo

Yusin Yang

Younghoon Sohn

A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.

Semiconductor module

Heart transfer label structure

Semiconductor module including package and heat transfer structure

Disclosed are an inspection method, an inspection system, and a method of fabricating a semiconductor package using the same. The inspection method comprises obtaining a reference value by measuring a surface profile of a reference pattern, scanning reference images of the reference pattern by using a plurality of optical inspection conditions, obtaining estimation values of the reference pattern that are measured from the reference images, selecting an desired optical inspection condition among the plurality of optical inspection conditions by comparing the reference value with the estimation values, scanning a target image of a target pattern by using the desired optical inspection condition, and obtaining an error value by quantitatively comparing the target image with a design image of the target pattern.

Inspection method, inspection system, and method of fabricating semiconductor package using the same

Growing community of inventors

Hwaseong-si, South Korea

Ilsoo Kim