Samsung Electronics Co., Ltd.

Eo Technics Co., Ltd

Ill Hyun Park

Jae Hee Lee

Tae Hee Han

Joo Yong Lee

Nam Hoon Lee

Jin Won Ma

Bong Ju Lee

Byung Joo Oh

Chang Seong Hong

Nam Ki Cho

Dae Yub Cho

Young Jung Kim

Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Monitoring device, monitoring method and method of manufacturing semiconductor device using reflectivity of wafer

Provided is an adhesive removing device for removing an adhesive for adhering a mask and a pellicle from the mask. The adhesive removing device includes: a laser irradiating unit configured to irradiate a laser beam to an adhesive layer formed between the mask and the pellicle; a controller configured to control a wavelength, a waveform, and an energy density of the laser beam, so as to remove the adhesive layer through emission of the laser beam; and an imaging unit configured to monitor a region to which the laser beam is irradiated.

Adhesive removing device and method

Growing community of inventors

Suwon-si, South Korea

Ill Hyun Park