Freescale Semiconductor,inc.

Nxp USA, Inc.

Temic Automotive of North America, Inc.

Ilko Schmadlak

Trent Uehling

Iyad Alhayek

Gerry Bianco

Juergen Broszeit

Gregory R Gayowsky

George Sotiropoulos

A method for manufacturing a semiconductor device is disclosed. The method includes generating a thermo-mechanical stress within a plurality of layers of a wafer, and after generating the thermo-mechanical stress, testing an interfacial strength level associated with one or more of the plurality of layers.

Methods and structures for detecting low strength in an interlayer dielectric structure

A method for bonding a wire to a substrate includes forming a wire ball at a working tip of a capillary and contacting the wire ball to a substrate via the capillary. The method also includes driving a protrusion at the working tip of the capillary into contact with a region of the substrate surrounding the wire ball. A capillary for wire bonding includes a working face, an annular chamfer section, and a cylindrical bore offsetting the annular chamfer section from the working face. A capillary for wire bonding includes a capillary body comprising a working tip having a working face. The capillary body defines an axial passage extending from the working face along a longitudinal axis of the capillary. The axial passage includes a cylindrical bore extending internally from the working face, and a first annular chamfer having a major diameter defined by the cylindrical bore.

Wire bonding capillary with working tip protrusion

Disclosed is a mounting structure for mounting an IC on a substrate, and particularly useful in a Multi-Chip Module (MCM). The mounting structure intervenes between the IC and the MCM substrate, and promotes heat dissipation from the IC. The mounting structure is insulative, and preferably comprises a direct bond to copper (DBC) board. A heat spreading region to which the IC is affixed is formed on a surface of the mounting structure with bond pad areas are around the heat spreading region. The other side of the mounting structure is mounted to the substrate, which also has bond pads. Bond pads on the IC are connected to the bond pad areas on the mounting structure, and the bond pad areas on the mounting structure are further coupled to the bond pads on the substrate. Each of these connections is preferably made by wirebonding. Thermal vias can be used in the mounting structure and/or in the substrate to further promote heat dissipation.

Integrated circuit mounting for thermal stress relief useable in a multi-chip module

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Feldkirchen, Germany

Ilko Schmadlak