Lg Electronics Inc.

Samsung Electronics Co., Ltd.

Fashion Factory Co. Ltd

Ilho Kim

Jinkyo Lee

Daebum Kim

Ho-young Lee

Insu Choi

Sung-Joon Kim

Kyung-Hee Han

Changho Yun

Keum Kyu Jeon

Kyungjin Park

Jinhun Jeong

Yunmi Hwang

Jinwoo Kim

Chaeeun Lee

Changho Kim

Nami Oh

Yeohoon Yoon

Seongju Ha

Yoonseok Choi

Wooseok Yoo

Yukyoung Kim

Jongwon Jeong

A semiconductor package is provided. The semiconductor package includes a redistribution structure having a front surface and a rear surface opposite the front surface, the redistribution structure including an insulating layer and a redistribution conductor provided in the insulating layer; a semiconductor chip provided on the rear surface and including a connection pad electrically connected to the redistribution conductor; an encapsulant provided on at least a portion of the semiconductor chip; under-bump metal (UBM) vias extending from the redistribution conductor to the front surface of the redistribution structure within the insulating layer; UBM pads provided on the front surface of the redistribution structure to correspond to the UBM vias, respectively, and each UBM pad of the UBM pads having an exposed surface convexly protruding away from the front surface of the redistribution structure; and a metal bump provided on the UBM pads and contacting the exposed surface of each UBM pad of the UBM pads.

Semiconductor package

A method for preparing error recovery of a memory device included in a memory system includes performing a training operation of the memory device upon power-on of the memory system, booting an operating system into a normal mode by operating the memory device using a selected operation frequency of a plurality of operation frequencies based on results of the training operation, detecting an error frequency among the plurality of operation frequencies in response to a change of the selected operation frequency of the memory device by the operating system, the error frequency being an operation frequency which causes at least one error in the memory device, and storing information regarding the detected error frequency in a first register included in a memory controller associated with the memory device.

Memory system including memory controller and memory device and method for recovering from an error thereof

A semiconductor package may include a first semiconductor chip, a second semiconductor chip spaced apart from the first semiconductor chip, an adhesive layer including an interposition portion and a side portion, and a molding layer. The molding layer may surround the first semiconductor chip, the second semiconductor chip, and the adhesive layer. The interposition portion may be between the first and second semiconductor chips. The side portion may contact a side surface of the first semiconductor chip and a side surface of the second semiconductor chip. A top surface of the side portion is curved, and an outer side surface of the side portion is flat.

Semiconductor package including adhesive layer and method for manufacturing the same

Disclosed is an electronic device including a memory module that includes at least one dynamic random access memory, and a processor configured to access the memory module, determine a corrected error count associated with an address of a corrected error in response to the corrected error being detected when data are read from the memory module, read an error log associated with the corrected error, determine a risk level of the corrected error based on the error log, and schedule a post package repair (PPR) for the address of the corrected error in response to the risk level of the corrected error being high.

Electronic device managing corrected error and operating method of electronic device

Padded jacket for pets

A parking system for a vehicle that is configured to perform a parallel parking maneuver and that includes: an object detection apparatus; at least one processor; and a computer-readable medium having stored thereon instructions that, when executed by the at least one processor, cause the at least one processor to perform operations that include: determining, through the object detection apparatus, information regarding at least one nearby parked vehicle; setting at least one edge point of the at least one nearby parked vehicle based on the information regarding the at least one parked vehicle; setting a reference line based on the set at least one edge point of the at least one parked vehicle; and providing a control signal to control the vehicle to perform a parallel parking maneuver with a body of the vehicle passing through the set reference line.

Parking system for vehicle and vehicle

A vehicle that operates in an autonomous driving mode and includes: an occupant sensing unit that is configured to sense an occupant inside the vehicle; and at least one processor configured to: determine, through the occupant sensing unit, whether the vehicle is occupied; and in a state in which the vehicle operates in the autonomous driving mode, control one or more in-vehicle devices based on a determination of whether the vehicle is occupied.

Autonomous vehicle

A parking assistance system for a vehicle includes: an object detection apparatus; at least one processor; and a computer-readable medium having stored thereon instructions that, when executed by the at least one processor, cause the at least one processor to perform operations that include: generating, through the object detection apparatus, information regarding an object located outside the vehicle; determining, based on the information regarding the object located outside the vehicle, that a parking space available outside the vehicle is a diagonal parking space; and generating a diagonal parking path for the vehicle to enter the parking space available outside the vehicle.

Parking assistance system

An apparatus configured to park a vehicle includes a plurality of cameras configured to acquire images of surroundings of the vehicle; a display configured to display an around-view image showing a view around the vehicle that is generated by combining the images acquired by the plurality of cameras; and a processor. The processor is configured to determine a first input that is applied on the around-view image displayed on the display; display, according to the first input that has been applied on the around-view image, a parking guide image representing a user-specified parking region for the vehicle; determine whether there is an actual parking region that matches the displayed parking guide image representing the user-specified parking region; and based on a determination that there is an actual parking region that matches the displayed parking guide image, provide a signal that controls a parking operation of the vehicle.

Apparatus for parking vehicle and vehicle

A user interface apparatus for a vehicle includes a display unit; an interface unit that receives information; at least one processor; and a computer-readable medium having stored thereon instructions that, when executed by the at least one processor, causes the at least one processor to perform operations that include: receiving, through the interface unit, first information regarding a planned autonomous parking operation of the vehicle, and second information regarding a progress of an autonomous parking maneuver performed by the vehicle based on the planned autonomous parking operation; displaying, through the display unit, a graphic object corresponding to the first information regarding the planned autonomous parking operation of the vehicle; and controlling the display unit to apply an animation effect to the graphic object being displayed, the animation effect corresponding to the second information regarding the progress of the autonomous parking maneuver performed by the vehicle.

User interface apparatus for vehicle and vehicle

A parking assistance apparatus includes a first sensor configured to sense a first environment corresponding to a first distance around a vehicle; a second sensor configured to sense a second environment corresponding to a second distance around the vehicle that is greater than the first distance; and a display configured to display a graphic image. The parking assistance apparatus also includes at least one processor configured to: acquire first information regarding the first environment around the vehicle and second information regarding the second environment around the vehicle; detect an available parking space based on the first information and based on the second information; and based on an available parking space being detected outside of the first environment, control the display to display information regarding the available parking space.

Parking assistance apparatus and vehicle having the same

A parking assistance apparatus for a vehicle, and including a camera configured to photograph surroundings of the vehicle; an interface configured to receive sensor information from the vehicle; a display configured to display a graphic image about an automatic parking function of the vehicle; and a processor configured to initiate the automatic parking function by controlling the vehicle to travel to a target parking position, detect a traveling resistance of the vehicle from the sensor information while the vehicle is traveling to the target parking position, determine a factor causing the traveling resistance, continue controlling the vehicle to travel to the target parking position when the detected traveling resistance is less than a predetermined resistance, and change the controlling of the vehicle to travel to the target parking position to offset the factor causing the traveling resistance, when the detected traveling resistance is equal to or greater than the predetermined resistance.

A support substrate, a method of manufacturing a semiconductor package, and a semiconductor package, the support substrate including a first plate; a second plate on the first plate; and an adhesive layer between the first plate and the second plate, wherein a coefficient of thermal expansion (CTE) of the adhesive layer is higher than a CTE of the first plate and higher than a CTE of the second plate.

Support substrate and a method of manufacturing a semiconductor package using the same

A method of fabricating a package-on-package (PoP) type of semiconductor package may include providing a lower package with a lower substrate, a lower semiconductor chip, and a lower mold layer and providing an upper package with an upper substrate, an upper semiconductor chip, and an upper mold layer. A through hole is formed to penetrate the upper package, and the upper package and lower package are electrically connected. A thermal interface material is injected into the through hole to form a first heat transmission part between, and in contact with, the upper package and the lower package.

Growing community of inventors

Seoul, South Korea

Ilho Kim