Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Dongwoo Fine-chem Co., Ltd.

Il Woo Park

Jong Rak Sohn

Chul Soo Yoon

Chang Hoon Kwak

Jung Hoon Kim

Kyung Tae Kim

Hyo Jin Lee

Joon Ho Yoon

Cheol Jun Yoo

Chang Bun Yoon

Seong Ah Joo

Yun Seup Chung

Na Na Park

Bong Jin Choi

Mi Hwa Yu

Yong Hwan Kim

Jacob-Changlin Tarn

Young Geun Yoon

Soo Moon Park

Na-Na Park

Young Mok Lee

There is provided a light emitting element package including: a light emitting laminate having a structure in which semiconductor layers are laminated and having a first main surface and a second main surface opposing the first main surface; a terminal unit disposed on an electrode disposed on the second main surface; a molded unit disposed on the second main surface of the light emitting laminate and allowing a portion of the terminal unit to be exposed; and a wavelength conversion unit disposed on the first main surface of the light emitting laminate.

Light emitting element package and method of manufacturing the same

A light-emitting element mounting substrate is provided. The light-emitting element mounting substrate includes an insulating base plate comprising a first surface, a second surface facing the first surface, and a plurality of pad regions disposed on the first surface in an m-by-n matrix form, each of m and n being a natural number; a first conductive pad that is disposed in one of the plurality of pad regions and is in contact with the insulating base plate; a second conductive pad that is disposed in another one of the plurality of pad regions apart from the first conductive pad and is in contact with the insulating base plate; a first through hole disposed at a position corresponding to the first conductive pad to penetrate the insulating base plate; a second through hole that is disposed at a position corresponding to the second conductive pad to penetrate the insulating base plate and is spaced apart from the first through hole; a first through conduit filling the first through hole and being in contact with the first conductive pad; and a second through conduit filling the second through hole and being in contact with the second conductive pad.

Light-emitting element mounting substrate and light-emitting package using the same

A method for manufacturing a semiconductor light emitting device package includes forming a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on a growth substrate, forming a reflective layer on a first surface of the light emitting structure corresponding to a surface of the second conductivity-type semiconductor layer, forming bumps on the first surface, the bumps being electrically connected to the first or second conductivity-type semiconductor layer and protruding from the reflective layer, bonding a support substrate to the bumps on the first surface, removing the growth substrate, bonding a light transmissive substrate coated with a wavelength conversion layer to a second surface of the light emitting structure from which the growth substrate is removed, and removing the support substrate. The reflective layer covers at least portions of side surfaces of the light emitting structure and the bumps.

Semiconductor light emitting device package and method for manufacturing the same

Provided is a bonding wire for a semiconductor package and a semiconductor package including the same. The bonding wire for the semiconductor package may include a core portion including silver (Ag), and a shell layer surrounding the core portion, having a thickness of 2 nm to 23 nm, and including gold (Au). The semiconductor package may include a package body having a first electrode structure and a second electrode structure, a semiconductor light emitting device comprising a first electrode portion and a second electrode portion electrically connected to the first electrode structure and the second electrode structure, and a bonding wire connecting at least one of the first electrode structure and the second electrode structure to the semiconductor light emitting device.

Bonding wire for semiconductor package and semiconductor package including same

An optical property evaluation apparatus includes: a light conversion filter converting light emitted from an LED chip or a bare LED package, which is to be evaluated, into a different wavelength of light, and emitting a specific color of light; and an optical property measurement unit receiving the specific color of light emitted from the light conversion filter and measuring the optical properties of the received light.

Apparatus and method for evaluating optical properties of LED and method for manufacturing LED device

A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.

Light emitting device surrounded by reflection wall and covered with fluorescent film

A control device for preventing meandering of patterns for use in a patterned film manufacturing device which includes a film transferring equipment and a pattern forming equipment, includes a marking unit that forms markings on a predetermined reference position on the film, a recognizing unit that is located at the rear of the marking unit and recognizes positions of the markings on the film, a computing unit that computes an amount of meandering based on differences between the reference position and the recognized positions of the markings, a control unit that generates a correction signal for correcting positions of the marking unit and the pattern forming equipment corresponding to the computed the amount of meandering, and a correction unit that receives the correction signal and corrects positions of the marking unit and the pattern forming equipment based on the received correction signal.

Control device for preventing meandering of patterns on patterned films

There is provided a light emitting device package including: a package body providing a chip mounting area and including first and second lead terminals; an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals; a groove portion disposed around the LED chip in the chip mounting area; and a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape defined by the groove portion.

Light emitting device package, backlight unit, display device and lighting device

Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light.

White light emitting diode with yellow, green and red light emitting phosphors

A white light emitting device capable of expanding the wavelength range of a blue LED used for realizing white light. The white light emitting device according to the present invention includes a blue LED and a mixture of orange phosphor and green phosphor disposed above the blue LED.

White light emitting device

A white light emitting device including: a blue light emitting diode (LED); a green silicate phosphor formed on the blue LED; and a red sulfide phosphor with a surface coated with a silicone oxide layer, the red sulfide phosphor formed on the blue LED.

White light emitting diode with yellow, green and red light emitting phosphor

The present invention relates to phosphor blend for wavelength conversion and a white light emitting device using the same. The phosphor blend of the invention comprises three phosphors, A(PO)Cl:Eu, DSiO:Eu and MS:Eu at a composition where near ultraviolet radiation is converted into light positioned at a CIE coordinate (x, y), where 0.25&#x2266;x&#x2266;0.45 and 0.25&#x2266;y&#x2266;0.43, wherein A comprises at least one of Sr, Ca, Ba, and Mg, D comprises at least one of Ba, Sr, and Ca, and M comprises at least one of Sr and Ca. Furthermore, the present invention provides a new white light emitting device in combination of the phosphor blend and a near ultraviolet LED.

Growing community of inventors

Suwon, South Korea

Il Woo Park