Heraeus Materials Singapore Pte. Ltd.

Heraeus Deutschland Gmbh & Co Kg

Il Tae Kang

Murali Sarangapani

Xi Zhang

Tae Yeop Kim

Chee Wei Tok

Yong-Deok Tark

Mong Hyun Cho

Jong Su Kim

Hyun Seok Jung

Yean Mee Pun

Kim Hui Chong

Tae Yeop James Kim

Abito Danila Bayaras

Sylvia Sutiono

Yong Deok Tark

A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 &#x3bc;m to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.

Process for electrically connecting contact surfaces of electronic components

A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.

Coated wire

Growing community of inventors

Kunsan, South Korea

Il Tae Kang