Lg Innotek Co., Ltd.

Il Sang Maeng

Tae Ho Kim

Ji Su Kim

Nam Hee Kim

Dong Wan Kim

Hye Sun Yoon

Sang Seon Ha

Song Hee Cho

Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board, forming a lower insulation layer under the insulation layer, and forming a via connected to terminals of the electronic device in the insulation layer or the lower insulation layer. Thus, since an adhesion material of an adhesion film does not remain between the internal circuit patterns, and the internal circuit patterns are not stripped by an adhesion force of the adhesion film, device reliability may be secured.

Printed circuit board and method for manufacturing the same

Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a flexible substrate divided into first, second, and third regions, a first rigid substrate in the first region of the flexible substrate, and a second rigid substrate in the third region of the flexible substrate. The first and second substrates expose the second region of the flexible substrate.

Growing community of inventors

Seoul, South Korea

Il Sang Maeng