Samsung Electronics Co., Ltd.

Il-ju Mun

Keon Kuk

Ji-woon Yeom

Kyong-il Kim

Yeon-kyoung Jung

O-hyun Beak

Jin-woo Jung

Young-su Lee

Eun-bong Han

Young-dae Ko

Hyeon-hyang Kim

A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

Hollow shielding structure for different types of circuit elements and manufacturing method thereof

An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

EMI shielding structure and manufacturing method therefor

A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof

An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.

Electromagnetic interference shielding structure

An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

Manufacturing method for EMI shielding structure

Manufacturing method of a hollow shielding structure for circuit elements

An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

EMI shielding structure

An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.

EMI shielding structure and manufacturing method thereof

A bubble removing apparatus for removing air bubbles in ink to be supplied to a printer head of an inkjet printer and a method of removing the air bubbles are provided to provide a smooth flow of ink to the inkjet printer head. When an air bubble removing operation is performed, ink in an ink tank is moved towards the printer head through a filter unit by operating the pump in a forward direction, and the ink that has moved towards the printer head is returned to the ink tank through the filter unit by operating the pump in a reverse direction. Air bubbles trapped in the filter unit are moved to the ink tank due to the operation of the pump in the reverse direction and are removed in the ink tank by the gravitational force, and thereby a smooth flowing ink supply can be provided to the printer head.

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Suwon-si, South Korea

Il-ju Mun