Samsung Electro-mechanics Co., Ltd.

Il Hwan Park

Hyun Hak Kim

Chul Ho Kim

Jeong Sik Seo

Gi Tae Do

Tae Sung Kim

Duk Woo Lee

Jong Lae Kim

Sae Won Oh

In an internal antenna, a first antenna part is disposed on a side of a mobile telecommunication terminal body having at least first and second peripheral surfaces and sides. The first antenna part processes a signal of a first band. Also, a second antenna part is disposed on one of the peripheral surfaces of the mobile telecommunication body. The second antenna part processes a signal of a second band.

Internal antenna having perpendicular arrangement

The present invention relates to an antenna module which can minimize the occupying space in an electronic device, enhancing degrees of freedom to increase efficiency in space utilization, thereby accommodating miniaturization and multi-functionality of the electronic device, and an electronic device having the same. The antenna module includes a flexible substrate, an antenna element having a feeder part, a first fixing part, and a radiation part. The antenna module further includes a feeder line connected to the feeder part having a feeder pad, a first fixing pad connected to the first fixing part, and a pad coupling element. In the invention, signals are processed via interaction between the resonance of the current running through the feeder line to the radiation part and the resonance of the current coming into the pad coupling element.

Antenna module and electronic device using the same

Disclosed herein is a chip antenna for terrestrial DMB. The chip antenna comprises a dielectric block, a main antenna device formed with conductive patterns in the dielectric block such that a plurality of unit lamination structures of the conductive patterns having a meander line structure in the direction of the Z-axis in an XZ plane are arranged in the direction of the Y axis while adjacent unit lamination structures are connected to each other, forming a lamination structure having the meander line structure in the directions of the Y-axis, and the plurality of lamination structures are arranged in the direction of the X-axis and adjacent lamination structures are connected to each other in the direction of the X-axis to have the meander line structure, and a T-shaped assistant antenna device formed at an upper or lower dielectric layer in the main antenna device.

Chip antenna for terrestrial DMB

Disclosed herein is a multi-layered chip antenna using double coupling feeding. The multi-layered chip antenna comprises a first feeding radiation element including a first feeding electrode connected at one side of the first feeding electrode to a feeding line and connected at the other side thereof to a ground surface while being formed on a first plane in a predetermined direction, the first feeding radiation element being connected to the first feeding electrode so that the first feeding radiation element has a spatial meander line structure, a second feeding radiation element connected to a portion of the first feeding electrode on a second plane parallel to the first plane such that the second feeding radiation element has a planar meander line structure, a second feeding electrode connected to a portion of the first feeding electrode on a third plane parallel to the first plane, a first parasitic radiation element electrically coupled to the second feeding electrode, and a second parasitic radiation element electrically coupled to the second feeding electrode and comprising a plurality of parasitic patterns.

Growing community of inventors

Kyungki-do, South Korea

Il Hwan Park