Daewoong Pharmaceutical Co., Ltd.

Nepes Co., Ltd.

Electronics and Telecommunications Research Institute

Il-Hwan Kim

Chang-Joo Kim

Myung-Sun Song

Chung-Gu Kang

Gwangzeen Ko

Sung-Hyun Hwang

Sun Ah Jun

Chun Ho Lee

Jun-Kyu Lee

Myunggi Jung

Ji Sung Yoon

Hyo Shin Kim

Hyung-Geun Lee

Bub-Joo Kang

Tae-Won Kim

Dong-Hoon Oh

Sung-Young Kim

Min-A Yoon

Disclosed herein are a semiconductor package and a method of manufacturing the same. The semiconductor package according to embodiments of the present disclosure includes a wiring including a plurality of layers including an insulating layer and a wiring layer, a semiconductor chip mounted on the wiring and electrically connected to the wiring layer through a bonding pad, a cover member configured to cover side surfaces of the semiconductor chip and the wiring and be in contact with at least one wiring layer, and an encapsulant configured to seal the cover member. Accordingly, the cover member covers the semiconductor chip and is in contact with the wiring formed under the semiconductor chip, thereby reducing electromagnetic interference, minimizing noise between operations of the semiconductor package, and improving a signal speed.

Semiconductor package and method of manufacturing the same

The invention relates to a compound represented by Chemical Formula 1, below, a pharmaceutically acceptable salt thereof, and a pharmaceutical composition comprising the compound or salt. The compound of the invention or pharmaceutically acceptable salts thereof can be used for the prevention or treatment of sodium channel blocker-related diseases. 

Substituted benzenesulfonamides as sodium channel blockers

Growing community of inventors

Chungcheongbuk-do, South Korea

Il-Hwan Kim