Skhynix Inc.

Hynix Semiconductor Inc.

Postech Academy-industry Foundation

Shin Poong Pharmaceutical Co., Ltd.

Shin Poong Pharmaceuticals Co., Ltd.

Il Hwan Cho

In Chul Hwang

Ki Jun Kim

Woong Hee Lee

Sei Kwang Hahn

Eui Jin Hwang

Ki Young Kim

Seung Hyun Lee

Ji Eun Kim

Tae Ho Lee

Qwan Ho Chung

Jong Hyun Nam

Jin Ho Bae

Young Soo Park

Jae Min Kim

Hyun Chul Seo

Myung Geun Park

Cheol Ho Joh

Sang Joon Lim

Jung Tae Jeong

Eun Hye Do

Byung Su Kim

Eun Ju Oh

Won Seok Kim

Chong Ho Cho

Jong Woo Yoo

Ga Hyun No

Jun Seok Yeom

Chul Kyu Lee

Hee Ra Roh

Sin Cheol Kang

Jae Joon Ahn

Jung Kyu Park

Eun Bang Lee

Kyoung Mo Yang

Dong Hwan Seol

Junseok Yeom

Jang Sik Shin

Moo Seok Seo

A package substrate includes a substrate body and a plurality of patterns disposed on the substrate body. The substrate body has a first region including a chip attachment region and a second region adjacent to the first region. The plurality of patterns are disposed on the substrate body in the second region. Each of the plurality of patterns extends in a first direction to have a stripe shape, and the plurality of patterns are spaced apart from each other in a second direction which is substantially perpendicular to the first direction. Related fabrication methods, electronic systems and memory cards are also provided.

Package substrates, packages including the same, methods of fabricating the packages with the package substrates, electronic systems including the packages, and memory cards including the packages

A semiconductor package includes a package substrate, a first semiconductor substrate and a second semiconductor substrate stacked on the package substrate, and an optical transceiver that generates and receives an optical signal travelling between the package substrate and the second semiconductor substrate using an infrared (IR) ray that passes through the first semiconductor substrate.

Semiconductor packages with optical transceivers

The present invention relates to a novel quinazoline-2,4-dione derivative of formula (I), a pharmaceutically acceptable salt thereof, and a pharmaceutical composition comprising a compound of formula (I) as an active ingredient for preventing or treating neurological brain disease.

Quinazoline-2,4-dione derivative, and medical compositions for the prophylaxis and treatment of cranial nerve disease containing the same

A semiconductor package includes a substrate and a plurality of semiconductor chips stacked on the substrate. Each of the semiconductor chips has a front surface, a rear surface opposite to the front surface, a sidewall surface connecting the front surface to the rear surface, a vertical through electrode extending from the front surface toward the rear surface with a predetermined depth, and a horizontal through electrode laterally extending from the sidewall surface to be connected to the vertical through electrode. At least one connection member is disposed on the sidewall surfaces of the semiconductor chips to connect the horizontal through electrodes of the semiconductor chips to each other. Related methods are also provided.

Semiconductor packages including through electrodes and methods of manufacturing the same

Substrates and semiconductor chips are provided. The substrate or the semiconductor chip includes a body and a substantially pillar-shaped bump disposed on a first surface of the body. The pillar-shaped bump has a hole penetrating a portion thereof. Related semiconductor packages are also provided. Further, related methods are provided.

Substrates having bumps with holes, semiconductor chips having bumps with holes, semiconductor packages formed using the same, and methods of fabricating the same

The present invention relates to a filler composition for tissue reinforcement, including hyaluronic acid and alkylene diamine crosslinked hydrogel. The filler composition exhibits the positive physical properties required for tissue reinforcement, such as biocompatibility and swelling ability, as well as useful effects in that the same can remain in vivo for a long time.

Filler composition for tissue reinforcement

The present invention relates to a composition for preventing tissue adhesion which comprising a bio-compatible hyaluronic acid and a polymer compound. More specifically, the invention is a composition containing hyaluronic acid which has not been modified by a chemical crosslinking or other chemical modification a method for preparing the same, and a composition for adhesion prevention with superior efficacy. The composition of the present invention for preventing adhesion exhibits a physical barrier function and a new adhesion prevention function whereby thrombus formation, which is the basis of adhesion, is inhibited. Unlike conventional compositions which simply mix polymeric substances that function as physical barriers, the present invention performs a more effective role as a physical barrier by undergoing decomposition, absorption and excretion after a certain period inside a human body, does not interfere with healing of scars following surgery, and exhibits superior effects since application to areas of surgery is convenient.

Composition for preventing adhesion

The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

Semiconductor package having substrate for high speed semiconductor package

A semiconductor chip includes a body part having a first surface and a second surface facing away from the first surface, and an opening passing from the first surface to the second surface of the body part.

Semiconductor chip and semiconductor package having the same

A flip chip package includes a substrate and a semiconductor chip. The substrate includes a substrate body, a metal wiring having a terminal part some of which is disposed in the substrate body, a solder resist pattern formed on the substrate body with an opening for exposing the terminal part, and an organic anti-oxidation layer for covering the terminal part. The semiconductor chip has a bump formed through (e.g., penetrates) the organic anti-oxidation layer and is electrically connected to the terminal part. The present invention prevents oxidation of the terminal part and allows easy coupling of a bump of a semiconductor chip and the terminal part of the substrate, since an anti-oxidation layer including an organic matter is formed over a surface of a terminal part including copper which is easily oxidized.

Flip chip package and method for manufacturing the same

Growing community of inventors

Icheon-si, South Korea

Il Hwan Cho