Mec Company Ltd.

Ikuyo Katayama

Itsuro Tomatsu

Yasutaka Amitani

Yuko Shibanuma

Kosuke Kumazaki

Hirofumi Kodera

Shota Hishikawa

The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of &#x2212;1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.

Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite

An etchant for copper includes an acid and one or more compounds selected from the group consisting of an aliphatic noncyclic compound, an aliphatic heterocyclic compound and a heteroaromatic compound. The aliphatic noncyclic compound is a saturated aliphatic noncyclic compound (A) including only two or more nitrogen atoms as heteroatoms, and 2 to 10 carbon atoms. The aliphatic heterocyclic compound is a compound (B) including a five-, six-, or seven-membered ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring. The heteroaromatic compound is a compound (C) including a six-membered heteroaromatic ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring.

Etchant, replenishment solution and method for forming copper wiring

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Hyogo, Japan

Ikuyo Katayama