Nichia Corporation

Kaneka Corporation

Ikuya Nii

Hiroaki Ukawa

Masafumi Kuramoto

Tomohide Miki

Saiki Yamamoto

Katsuya Ouchi

Masahito Ide

Toshimasa Takao

Manabu Tsumura

Nobuhide Kasae

The present invention provides a light emitting device which has high reliability and long service life by suppressing the sealing resin from peeling off the inner edge of the opening of the recess of the housing. The light emitting device of the present invention comprises a light emitting element having a pair of electrodes, a housing having a recess for accommodating the light emitting element, a first lead electrode and a second lead electrode which are exposed on the bottom of the recess, electrically conductive members for electrically connecting the pair of electrodes of the light emitting element to the first lead electrode and to the second lead electrode respectively, a transparent sealing material which fills in the recess and granular additives contained in the sealing material, wherein the inner wall surface of the recess has a light blocking section that blocks light emitted by the light emitting device toward the inner edge of the opening of the recess, the quantity of the granular additives contained in the sealing material is controlled to such a level that enhances scattering of light in a first region located below the light blocking section and to such a level that suppresses scattering of light in a second region located above the light blocking section.

Light emitting device

The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area. The semiconductor device of the present invention comprises a semiconductor elementhaving a pair of electrodes, a housinghaving the recessfor accommodating the semiconductor element, a first lead electrodeand the second lead electrodewhich are exposed on the bottom of the recess, an adhesive layerfor die bonding between the semiconductor elementand the first lead electrode, and electrically conductive wiresfor wire bonding between one electrode of the pair of electrodes of the semiconductor element and the first lead electrodeand between the other electrode and the second lead electrode, wherein the housinghas the wallformed to extend across the bottom surface of the recessso as to divide the surface of the first lead electrodeinto a die bonding areaand a wire bonding area, and the first lead electrodehas the notchwhich is formed by cutting off a portion of an edge of the first lead electrodeand located at least just below the wall, while the walland the bottom portionof the housingare connected to each other through the notch

Semiconductor device

The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.

Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product

Growing community of inventors

Anan, Japan

Ikuya Nii