Nec Corporation

Ikusi Morizaki

Yuzo Shimada

Naoji Senba

Hideki Kusamitu

Katsumasa Hashimoto

Makoto Ohtsuka

A three-dimensional memory module includes a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bump connecting method. Each of the plurality of semiconductor device units includes a carrier having a circuit pattern and the through-holes connected to the circuit pattern. The semiconductor device unit also includes at least one semiconductor memory chip mounted on the carrier such that the semiconductor memory chip is connected to the circuit pattern, and at least one chip select semiconductor chip mounted on the carrier to be connected to the circuit pattern such that the chip select semiconductor chip can select the semiconductor memory chip.

Growing community of inventors

Tokyo, Japan

Ikusi Morizaki