Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Rohm Co., Ltd.

Ikuo Yoshida

Yasuhiro Maenishi

Akihito Yamasaki

Takuya Yamazaki

Hiroyoshi Nishida

Masaya Matsumoto

Chikashi Konishi

Junichi Hikita

Kazuhide Ino

Masamichi Morimoto

Toshiki Kindo

Satoshi Masuda

Takahiro Inoue

Takehiko Shida

Tomotaka Nishimoto

Hiroyuki Kondo

Makoto Hirahara

Kouichi Yabuki

A power supply control method of a production system including a first unit and a second unit includes: starting power supply for operation of the second unit in accordance with a signal acquired according to an operation status of the first unit (S); starting the operation by the second unit after the start of the power supply (S); acquiring stop time information indicating time from when the operation ends to when a next operation of the second unit starts (S); determining, based on the acquired stop time information, whether or not to stop the power supply after the started operation ends (S); and stopping the power supply when it is determined to stop the power supply (S).

Production system power supply control method, and production system

To provide a component mounting order optimizing method and a component mounting order optimizing apparatus by which it is easy to change a preparatory plan and it is possible to shorten time necessary for a change of substrates to be produced. An optimization program storage sectionhas a placement list preparing sectionwhich obtains component placement data to be obtainable by a component information reading devicereading identification information of a component cassette, and prepares a component placement list in which identification information of component cassettes and positions which are loaded in a component supply section were associated, and a mounting order deciding sectionwhich decides mounting order of components in such a state that an array of the component cassettes is fixed, on the basis of the component placement list.

Component mounting order deciding method and component mounting order deciding apparatus

To provide a line balance control method, a line balance control apparatus, and a component mounting machine, which do not require a higher-level device. A production lineis equipped with a printing machine, a coating machine, a component mounting machine, a component mounting machine, and a reflow machine, and they are connected through a communication line, respectively. In addition, a line balance control device, which is equipped with possibility inquiring means which makes an inquiry of whether or not it is possible to mount components to be allocated, among the components to be mounted, to the component mounting machines, possibility obtaining means which obtains a response to the inquiry in the possibility inquiring means, and allocating means which allocates components to be mounted, to each component mounting machine, in such a manner that mounting time at each component mounting machine is equalized, on the basis of the response obtained in the possibility obtaining means, is disposed in a device which configure the production line

Line balance control method, line balance control apparatus, and component mounting machine

A method of optimizing an order of component mounting which includes optimizing an order of component mounting for any one pattern among the plurality of patterns, calculating a quotient and a remainder by dividing the total number of the patterns included in the board by the number of mounters, determining the quotient as the number of patterns to be allocated in a case where the remainder is zero. The optimization method also includes determining a number, which is the quotient plus one, as the number of patterns to be allocated to the same number of the mounters as the remainder, starting from the mounter in a process farthest upstream, determining the quotient as the number of patterns to be allocated to the rest of the mounters, in the case where the remainder is one or greater, and allocating the allocated number of patterns, to each of the mounters.

Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting

A component verification method for a mounter () that is capable of performing component verification with less labor. The method includes a position specification step (SA) of specifying a placement position in the mounter () where a component tape is placed; a read step (S) of reading component information from an IC tag () that is attached to the component tape or a reel (); and a verification step (S) of verifying the component information and the placement position against component arrangement data that indicates components that should be mounted onto the board as well a position where the component tape should be placed.

Component verification method and apparatus

An optimizing apparatus for optimizing a mounter equipped with a line gang pickup head which picks up a plurality of components and mounts them on a board. The apparatus includes a nozzle set determination unit for determining a nozzle set which reduces a mounting time in view of a number of times interchanging pickup nozzles and a total task number necessary for mounting the plural components, a nozzle pattern determination unit for determining an optimal nozzle pattern as well as an arrangement of pickup nozzles (nozzle arrangement) at a nozzle station, based on the nozzle set determined by the nozzle set determination unit, and Z-axis arrangement/mounting order optimization unit for determining an array order of component feeders and a mounting order of components while maintaining the determined nozzle set and nozzle pattern.

Method for optimization of an order of component mounting, apparatus using the same, and mounter

An optimization apparatus capable of efficiently placing an electronic component. An optimization unit () determines a first assignment to the placement apparatus and calculates a first placement time required for placing all the electronic components assigned to the placement apparatus by the first assignment onto a circuit board by the placement apparatus. The optimization unit selects two placement apparatuses among a plurality of placement apparatuses, selects a type of an electronic component assigned for the selected placement apparatus, determines a second assignment by interchanging two selected times assigned, calculates a second placement time required for placing all the electronic components assigned to the placement apparatus by the second assignment onto the circuit board by the placement apparatus, and employs the one of the first assignment and the second assignment which has a smaller placement time.

Method for optimizing placement order by placement apparatuses that place electronic components on circuit board

A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface of the semiconductor wafer held by the wafer holding mechanism, detecting opening of a bottom face of the groove during the back surface grinding process to determine timing for finishing the back surface grinding. The opening of the groove can be detected by means of a light sensor for detecting light passing through the groove or a microwave sensor for detecting a microwave passing through the groove. In addition, it is possible to suck air inside the groove so as to detect the opening of the groove by a pressure rise in the air inside the groove.

Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips

The present invention provides a component mounting sequence optimizing method, a component mounting device, a program for executing the component mounting sequence optimizing method, and recording medium in which the program is recorded, in the component mounting device with a component holding head capable of holding a plurality of components and having a component recognition camera. The invention includes a component mounting sequence optimizing device and a mounting sequence for components is determined on basis of a result of comparison between conveyance times for the components and recognition times required for recognitions of the components. Thus cycle time for mounting can be reduced, in comparison with conventional arts, in mounting of components with a component holding head having a plurality of component holding members and having a component recognition camera.

Component mounting sequence optimizing method, component mounting device, program for executing component mounting sequence optimizing method, and recording medium in which the program is recorded

The following processing is performed when a line gang pickup head can simultaneously pick up a maximum of n (here, 4) components. First, groupings of components of the same type, out of all of the components to be optimized, are set as component tapes and the component tapes are arranged descending order of the number of components to produce a component histogram (). Next, a partial histogram (), which is part of the component histogram (), is taken from the component histogram (), and is arranged at two-dimensional coordinates where a horizontal axis (the Z-axis) represents an arrangement of component cassettes and a vertical axis represents a number of pickup operations by the line gang pickup head. After this, the component tapes are lined up, by arranging the partial histograms (and), so as to produce a diagram () whose width (number of components) in the horizontal axis is n (=4).

There are provided a method and device for generating component mounting data in view of productivity, quality assurance, safety, or the like, when components are mounted onto a mounting target, and a component mounting method and device by which a mounting operation can be performed based on the data. Rules that must be observed, or are desired to be observed, based on various conditions such as mounting apparatus and component information and the like are automatically generated in view of productivity, quality assurance, safety, or the like and can be utilized for generation of component mounting data.

Method for generating component mounting data and component mounting method

An electronic component mounting method for placing electronic components successively to component placing positions on a board by component holding devices equipped with a plurality of removable suction nozzles which is operable to hold the electronic components. The method, as an example of its various manners, includes: in placing the electronic components onto a multiple board composed of a plurality of sub-boards, applying a placement step to all the sub-boards, the placement step being a step of placing onto the board all of electronic components that are holdable by an identical suction nozzle; and after completion of the placement step, changing the suction nozzle to another and moving to a next placement step, whereby electronic-component mounting for the individual sub-boards is carried out. In another aspect, component array intervals (M) of component feed sections or intervals (N) of component placing positions on the board are made coincident with array intervals (L) of the component holding devices.

Component mounting method and component mounting apparatus

A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface of the semiconductor wafer held by the wafer holding mechanism detecting opening of a bottom face of the groove during the back surface grinding process to determine timing for finishing the back surface grinding. The opening of the groove can be detected by means of a light sensor for detecting light passing through the groove or a microwave sensor for detecting a microwave passing through the groove. In addition, it is possible to suck air inside the groove so as to detect the opening of the groove by a pressure rise in the air inside the groove.

Growing community of inventors

Uji, Japan

Ikuo Yoshida