Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Canon Kabushiki Kaisha

Kioxia Corporation

Canon Nanotechnologies, Inc.

Ikuo Yoneda

Masamitsu Itoh

Tetsuro Nakasugi

Ryoichi Inanami

Shinji Mikami

Hiroshi Tokue

Naomi Shida

Kenji Todori

Reiko Yoshimura

Tsukasa Tada

Masayuki Hatano

Shigehiko Mori

Hiroyuki Kashiwagi

Shinichi Ito

Hideaki Sakurai

Hideki Kanai

Takuya Kono

Yoshihisa Kawamura

Shunko Magoshi

Yoshiharu Ono

Yutaka Watanabe

Yasuyuki Hotta

Masakazu Yamagiwa

Kazuhiro Takahata

Ko Yamada

Keiji Yamashita

Takahito Nishimura

Yasutada Nakagawa

Takeshi Koshiba

Soichi Inoue

Satoshi Tanaka

Kenji Kawano

Hirokazu Kato

Eishi Shiobara

Kentaro Matsunaga

Manabu Takakuwa

Takumi Ota

Yukiko Kikuchi

Hironobu Tamura

Kenji Ooki

Provided is an imprint apparatus that applies a resin (drops) dispersed at a plurality of locations on a substrate, brings the resin and a mold into contact, and transfers the contoured pattern that is formed in the mold to the resin comprising: a controller that sets a principal axis direction according to the contoured pattern and an array direction in which a plurality of resin drops are aligned, and determines application positions for the resin such that the array direction is angled with respect to the principal axis direction; and a dispenser that applies the resin based on the application positions that have been determined.

Imprint apparatus, imprint method, and article manufacturing method

According to one embodiment, a liquid delivery member is provided which is to be arranged at a predetermined distance from a processing object, and which is configured to deliver a liquid from a slit while the liquid delivery member and the processing object are caused to make relative displacement therebetween in a first direction. The liquid delivery member includes a delivery amount adjustment part provided on a face that forms the slit, extending in a second direction orthogonal to the first direction, and configured to adjust a delivery amount of the liquid.

Liquid delivery member, liquid delivery apparatus, and semiconductor device manufacturing method

A method of designing a template pattern used for imprint lithography, includes generating data of a dummy template pattern to be formed in a third area between first and second areas of a template based on data of a design pattern of the template, the data of the dummy template pattern being generated so that a third surface area ratio showing a ratio of a surface area of the third area to an area of the third area is set smaller than a first surface area ratio showing a ratio of a surface area of the first area to an area of the first area and larger than a second surface area ratio showing a ratio of a surface area of the second area to an area of the second area.

Method of designing a template pattern, method of manufacturing a template and method of manufacturing a semiconductor device

According to one embodiment, an imprint apparatus including multiple types of imprint units and a conveyor to convey a substrate is provided. Each of the imprint units includes a suction mechanism configured to hold the substrate with multiple suction portions on a substrate holder, and a template having an imprint surface on which a concavo-convex pattern is formed on one face of a template substrate and having a recessed region in the other face, the recessed region corresponding to the imprint surface. The imprint units have different depths of the recessed regions in the templates and different arrangements of the suction portions in the suction mechanisms depending on the types.

Imprint apparatus and imprint method

According to one embodiment, a device substrate includes a multilayer film that includes a film constituting a device element and is disposed on a substrate. A main face on which the device element is disposed includes a patterning region on which a resist is to be applied during an imprint process, and a bevel region provided as a region from a peripheral edge portion of the patterning region to an end portion of the device substrate. The bevel region includes a region where an upper surface of the bevel region becomes lower toward the end portion of the device substrate relative to an upper surface of the patterning region. The upper surface of the bevel region has an inclination angle of 10&#xb0; or more and 90&#xb0; or less with respect to the upper surface of the patterning region, at a boundary between the patterning region and the bevel region.

Device substrate, method of manufacturing device substrate, and method of manufacturing semiconductor device

Provided is an imprint apparatus that applies a resin to several locations on a substrate, brings the resin and a mold into contact, and transfers a contoured pattern formed in the mold to the resin, comprising: a controller that sets a principal axis direction according to the contoured pattern and determines the application positions of the resin based on the principal axis direction that has been set such that the distances between resin drops that have been applied so as to be separated in the principal axis direction is larger than the distances between resin drops that have been applied so as to be separated in a direction that is perpendicular to the principal axis direction; and a dispenser that applies the resin based on the application position that has been determined.

An imprint pattern forming method includes contacting a template with a pattern in a front surface with an imprint material formed in a substrate to fill the imprint material into the pattern, curing the imprint material filled in the pattern to form an imprint material pattern, and after forming the imprint material pattern, separating the template from the imprint material pattern while applying pressure to the back surface of the template.

Imprint pattern forming method

A near-field exposure mask according to an embodiment includes: a substrate; a concave-convex structure having convexities and concavities and formed on one surface of the substrate; a near-field light generating film arranged at least on a tip portion of each of the convexities, the near-field light generating film being a layer containing at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C, or a film stack formed with layers made of some of those materials; and a resin filled in each of the concavities.

Pattern forming method

According to an aspect of the present invention, there is provided a pattern forming apparatus in which a mold having a pattern is brought into contact with an imprinting material on a substrate to transfer the pattern, the apparatus including: a holding part configured to hold the mold; a moving part configured to move the holding part so that the mold is brought into contact with the imprinting material on the substrate and that the mold is removed therefrom; and a control part configured to control so that at least one of conditions of removing the mold can be changed based on conditions of the pattern formed in the mold, the conditions including a rate and an angle of removing the mold.

Pattern forming method and pattern forming apparatus

A near-field exposure mask according to an embodiment includes: a silicon substrate; and a near-field light generating unit that is formed on the silicon substrate, the near-field light generating unit being a layer containing at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C, or a film stack formed with layers made of some of those materials.

Near-field exposure mask, resist pattern forming method, device manufacturing method, near-field exposure method, pattern forming method, near-field optical lithography member, and near-field nanoimprint method

A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template.

Growing community of inventors

Yokohama, Japan

Ikuo Yoneda