Japan Science and Technology Agency

Other

Toyota Jidosha Kabushiki Kaisha

Tohoku University

Ikuo Ohnuma

Kiyohito Ishida

Ryosuke Kainuma

Jun Sato

Toshihiro Omori

Yoshikazu Takaku

Katunari Oikawa

Yasushi Yamada

Katsunari Oikawa

Takashi Atsumi

Yuji Yagi

Ikuo Nakagawa

Keisuke Ando

Takehito Hagisawa

Mikio Shirai

Toshihiro Ohmori

Kiyogito Ishida

A hydrogen gas generating member includes a metal alloy having dispersed aluminum. The metal alloy includes an Al&#x2014;X alloy, where X is Sn: 10.1 to 99.5% by mass, Bi: 30.1 to 99.5% by mass, In: 10.1 to 99.5% by mass, Sn +Bi: 20.1 to 99.5% by mass, Sn +In: to 10 to 99.5% by mass, Bi+In: 20.1 to 99.5% by mass, or Sn+Bi+In: 20 to 99.5% by mass. Hydrogen gas is generated by bringing the hydrogen gas generating member into contact with water.

Hydrogen gas generating member and hydrogen gas producing method therefor

A process for producing a Co-base alloy which has a basic composition including, in terms of mass proportion, 0.1%-10% Al, 3.0-45% W, and Co as the remainder and has an intermetallic compound of the L1type [Co(Al,W)] dispersed and precipitated therein. Part of the Co may be replaced with Ni, Ir, Fe, Cr, Re, or Ru, while part of the Al and W may be replaced with Ni, Ti, Nb, Zr, V, Ta or Hf. The intermetallic compound [Co(Al, W)] has a high melting point, and this compound and the matrix are mismatched little with respect to lattice constant. Thus, the cobalt-base alloy can have high-temperature strength equal to that of nickel-base alloys and excellent structure stability.

Cobalt-base alloy with high heat resistance and high strength and process for producing the same

An Fe-based shape memory alloy comprising 25-42 atomic % of Mn, 12-18 atomic % of Al, and 5-12 atomic % of Ni, the balance being Fe and inevitable impurities, and an Fe-based shape memory alloy comprising 25-42 atomic % of Mn, 12-18 atomic % of Al, and 5-12 atomic % of Ni, as well as 15 atomic % or less in total of at least one selected from the group consisting of 0.1-5 atomic % of Si, 0.1-5 atomic % of Ti, 0.1-5 atomic % of V, 0.1-5 atomic % of Cr, 0.1-5 atomic % of Co, 0.1-5 atomic % of Cu, 0.1-5 atomic % of Mo, 0.1-5 atomic % of W, 0.001-1 atomic % of B and 0.001-1 atomic % of C, the balance being Fe and inevitable impurities.

Fe-based shape memory alloy and its production method

A Co-base alloy which has a basic composition including, in terms of mass proportion, 0.1%-10% Al, 3.0-45% W, and Co as the remainder and has an intermetallic compound of the Lltype [Co(Al,W)] dispersed and precipitated therein. Part of the Co may be replaced with Ni, Ir, Fe, Cr, Re, or Ru, while part of the Al and W may be replaced with Ni, Ti, Nb, Zr, V, Ta or Hf. The intermetallic compound [Co(Al, W)] has a high melting point, and this compound and the matrix are mismatched little with respect to lattice constant. Thus, the cobalt-base alloy can have high-temperature strength equal to that of nickel-base alloys and excellent structure stability.

A zinc based solder materialof the present invention is prepared by providing on the surface of a zinc based material, from which an oxide filmhas been removed or at which an oxide filmdoes not exist, with a coating layercontaining primarily a metal whose oxide is more easily reducible than the oxide film. In a joined body and a power semiconductor module of the present invention, the zinc based solder materialis used in the joining portion, and after joining, the coating layerdoes not exist.

Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same

An iridium-based alloy which has L1-type intermetallic compounds dispersedly precipitated therein and has a basic composition including, in terms of mass proportion, 0.1 to 9.0% Al, 1.0 to 45% W, and Ir as the remainder. The component system containing 0.1 to 1.5% Al has L1-type intermetallic compounds dispersedly precipitated therein. The component system containing 1.5 to 9.0%, excluding 1.5%, Al has L1-type and B2-type intermetallic compounds dispersedly precipitated therein. Part of the Ir may be replaced with an element (X) (Co, Ni, Fe, Cr, Rh, Re, Pd, Pt, or Ru) and part of the Al and W may be replaced with an element (Z) (Ni, Ti, Nb, Zr, V, Ta, Hf, or Mo). The iridium-based alloy, which contains L1-type intermetallic compounds [1r(Al,W) and [(Ir, X)(Al, W, Z)] dispersedly precipitated therein, has a high melting point. The lattice constant mismatch between the L1-type intermetallic compounds, i.e., [Ir(Al, W)] and [(Ir, X)(Al, W, Z)], and the matrix is small and, hence, the iridium-based alloy is excellent in high-temperature strength and structural stability.

Iridium-based alloy with high heat resistance and high strength and process for producing the same

A member having a separated structure made by an alloy consisting of two regions having different compositions with each other is formed by casting a molten alloy into a prescribed shape, or by spray-quenching the same from a temperature of Tc+10&#xb0; C. or more, wherein the molten alloy exhibits two phase separation in a liquid state having a temperature difference &#x394;T between the maximum temperature Tc (&#xb0; C.) and minimum temperature Td (&#xb0; C.) in the region of two phase separation in the liquid state being 10&#xb0; C. or more, and the molten alloy has a mean composition with a difference of the volume fraction between the two liquid phases of 5% by volume or more. The suitable alloy is a Cu&#x2014;Fe&#x2014;X alloy, a Cu&#x2014;Cr&#x2014;X alloy, a Cu&#x2014;Co&#x2014;X alloy, a Cu&#x2014;Bi&#x2014;X alloy, an Al&#x2014;Sn&#x2014;X alloy or an Al&#x2014;In&#x2014;X alloy. The powder obtained by spray-quenching any one of the molten alloys of the Cu&#x2014;Bi&#x2014;X alloy, the Al&#x2014;Sn&#x2014;X alloy and the Al&#x2014;In&#x2014;X alloy has a separated structure comprising a surface portion having a solder composition and a core portion with a composition mainly comprising Cu and Al being excellent in electrical conductivity and heat conductivity and is suitable as a solder ball.

Growing community of inventors

Shibata-gun, Japan

Ikuo Ohnuma