Tokyo Electron Limited

Ikuo Ogasawara

Munetoshi Nagasaka

Eiichi Shinohara

Yoshiyasu Kato

Ken Taoka

Isao Kouno

A probe apparatus includes a movable mounting table for holding a test object provided with a plurality of power devices including diodes; a probe card arranged above the mounting table with probes; a measuring unit for measuring electrical characteristics of the power devices by bringing the probes into electrical contact with the test object in a state that a conductive film electrode formed on at least a mounting surface of the mounting table is electrically connected to a conductive layer formed on a rear surface of the test object; and a conduction member for electrically interconnecting the conductive film electrode and the measuring unit when measuring the electrical characteristics. The conduction member is interposed between an outer peripheral portion of the probe card and an outer peripheral portion of the mounting table.

Probe apparatus

A probe cardincludes a first probeconfigured to come into electric contact with an emitter electrode of a power device D; a block-shaped first connecting terminalto which the first probeis connected; a second probeconfigured to come into electric contact with a gate electrode of the power device D; a block-shaped second connecting terminalto which the second probeis connected; a contact plateconfigured to come into electric contact with a collector electrode of the power device D; and a block-shaped third connecting terminalfixed to the contact plate. Further, the first connecting terminal, the second connecting terminaland the third connecting terminalelectrically come into direct contact with corresponding connection terminals of a tester, respectively.

Probe card for power device

A carrier supporting apparatus is configured to support a carrier containing a plurality of plate-like objects to be processed, such that each object to be processed is arranged vertically at an interval in a horizontal attitude. The carrier includes multiple sets of supporting stages each arranged vertically at an interval, wherein each set of the supporting stages are configured to support the periphery of a bottom face of one object to be processed. The carrier supporting apparatus comprises a placing table adapted to place the carrier thereon, a lifting member that can be raised and lowered relative to the placing table, and a drive mechanism adapted to drive the lifting mechanism. When raised, the lifting member raises a bottom face of the object to be processed, which is supported on a set of the lowermost supporting stages in the carrier, and lifts it up from the supporting stages.

Carrier supporting apparatus

A substrate attracting device includes an attracting body for attracting and holding a substrate to transfer the substrate. The attracting body includes a first attracting unit for attracting and holding a top surface of the substrate according to Bernoulli principle and a second attracting unit for vacuum-attracting and holding a bottom surface of the substrate.

Substrate attracting device and substrate transfer apparatus

Wafer attracting plate

Wafer holding member

A wafer chuck is provided with a plurality of pins which protrude and retreat in a plurality of through holes formed in a vertical direction on a mounting table, and an ascending/descending mechanism for ascending and descending the pins. The wafer chuck receives a wafer by protruding the pins from the mounting plane of the mounting table. On each upper end surface of the pin, a receiving surface part is provided for substantially not making a gap between the pin and each of the corresponding through holes and a mechanism for aligning the receiving surface part with the mounting surface is provided.

Growing community of inventors

Nirasaki, Japan

Ikuo Ogasawara