Applied Materials, Inc.

Kovio, Inc.

Thin Film Electronics Asa

Ikuo Mori

John M White

Shinichi Kurita

Erik C Scher

Joerg Rockenberger

Arvind Kamath

Suhail Anwar

Makoto Inagawa

Dong-Kil Yim

Steven E Molesa

Jozef Kudela

Hans Georg Wolf

Dennis Zvalo

Wenzhuo Guo

Vladimir K Dioumaev

J Devin MacKenzie

Dmitry Karshtedt

The present invention generally relates to a vertical CVD system having a processing chamber that is capable of processing multiple substrates. The multiple substrates are disposed on opposite sides of the processing source within the processing chamber, yet the processing environments are not isolated from each other. The processing source is a horizontally centered vertical plasma generator that permits multiple substrates to be processed simultaneously on either side of the plasma generator, yet independent of each other. The system is arranged as a twin system whereby two identical processing lines, each with their own processing chamber, are arranged adjacent to each other. Multiple robots are used to load and unload the substrates from the processing system. Each robot can access both processing lines within the system.

Vertical inline CVD system

Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.

Print processing for patterned conductor, semiconductor and dielectric materials

Methods for repairing an electrical circuit; compositions, inks and equipment for making such repairs; and repair structures formed by the methods. The method generally includes the steps of: (a) depositing a composition comprising nanoparticles of an electrically functional material such that it contacts first and second elements of the circuit; and (b) sufficiently irradiating at least part of the composition with light to fuse or bind the nanoparticles to each other. The composition and ink generally comprise such nanoparticles and a sensitizer having a light absorption maximum at a wavelength different from that of the nanoparticles. The apparatus comprises: (1) a deposition apparatus configured to deposit a liquid film of an electrically functional material on the circuit; (2) a light source configured to irradiate at least part of the thin film; and (3) a table configured to secure the substrate. The structure generally comprises a circuit element having an electrical disconnect, and a cured electrically functional material (i) in electrical contact with first and second locations on the circuit elements adjacent to the disconnect, and (ii) forming a continuous electrical path between the disconnected circuit portions. The present invention provides a fast, reliable method for repairing electrical circuits. The repair structures have electrical properties similar to the corresponding bulk or sheet materials. The invention is well suited for use with existing circuit inspection and testing equipment, thereby providing a 'one tool' solution to testing and repairing electrical circuits.

Methods of laser repairing a circuit, compositions and equipment for such methods, and structures formed from such methods

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San Jose, CA, United States of America

Ikuo Mori