Taiyo Yuden Co., Ltd.

Other

Chuki Seiki Co., Ltd.

Ikuo Kakiuchi

Ichiro Yokoyama

Yoshikazu Maruyama

Masataka Kohara

Keiichi Nozawa

Masakazu Okazaki

Manabu Takayama

Shinichi Harada

Noriyuki Mabuchi

Tomoyuki Oyoshi

Chikako Yoshida

Shoichi Tosaka

Manabu Teraoka

Sadaaki Kurata

Masami Seto

Kiyoshi Tanbo

Takashige Shiga

Masaru Maeda

Masuo Yatabe

An electronic component includes: an insulator part () of rectangular solid shape; a coil element () provided inside the insulator part (); bottom electrodes () provided on a bottom face () of the insulator part () and electrically connected to the coil element (); a plating layer () provided in a manner overlapping each bottom electrode () so that its end () on the bottom face () is away from the end () of the bottom electrode (); a plating layer () which is arranged between the bottom electrode () and the plating layer () and overlaps the bottom electrode (), and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer (); and an insulation layer () provided on the bottom face () in a manner covering the end () of the bottom electrode ().

Electronic component and electronic apparatus

In an embodiment, an electronic component includes: an insulator partof rectangular solid shape; a coil elementprovided inside the insulator part; bottom electrodesprovided on a bottom faceof the insulator partand electrically connected to the coil element; a plating layerprovided in a manner overlapping each bottom electrodeso that its endon the bottom faceis away from the endof the bottom electrode; and a plating layerwhich is arranged between the bottom electrodeand the plating layerand overlaps the bottom electrode, and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer. The electronic component can suppress generation of cracking in the insulator part.

Electronic component, electronic apparatus, and method for manufacturing electronic component

One object of the present invention is to enable identification of the direction of an electronic component, while suppressing increase in cost. The present invention provides an electronic component comprising: an insulator portion having a plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces), the insulator portion including a plurality of regions having different transmissivities of a light beam entering one of the plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces); an internal conductor portion provided in the insulator portion; and external electrodes provided on the insulator portion and electrically connected to the internal conductor portion.

Electronic component

A device includes: a pillar-shaped core consisting of a first magnetic insulating material that has two quadric prism segments at both ends thereof symmetrically and has a cylindrical segment, which has an external shape smaller than that of the quadric prism segments, coaxially between the two quadric prism segments; a resistance film that is formed in a substantially uniform thickness so as to cover an outer circumferential face of the pillar-shaped core; a spiral line segment having a predetermined number of circumferences that is formed in a portion present on the cylindrical segment of the resistance film by subjecting a spiral sulcus to laser trimming; an oxide film that is formed to cover at least a surface of a shoulder portion extending from a side to an upper surface of lines constituting the spiral line segment; an armor consisting of a second magnetic insulating material that is formed to cover a surface of the portion present on the cylindrical segment of the resistance film and such that an external shape the armor is a quadric prism shape; and a pair of external electrodes that are formed in a substantially equal thickness so as to cover surfaces of portions present on an end face and four sides of the respective quadric prism segments of the resistance film.

Noise rejection device and cellular phone including the noise rejection device

A device includes: a pillar-shaped core consisting of a first magnetic insulating material that has two quadric prism segments at both ends thereof symmetrically and has a cylindrical segment, which has an external shape smaller than that of the quadric prism segments, coaxially between the two quadric prism segments; a conductor film that is formed in a substantially uniform thickness so as to cover an outer circumferential face of the pillar-shaped core; a spiral line segment having a predetermined number of circumferences that is formed in a portion present on the cylindrical segment of the conductor film by subjecting a spiral sulcus to laser trimming; an oxide film that is formed to cover at least a surface of a shoulder portion extending from a side to an upper surface of lines constituting the spiral line segment; an armor consisting of a second magnetic insulating material that is formed to cover a surface of the portion present on the cylindrical segment of the conductor film and such that an external shape the armor is a quadric prism shape; and a pair of external electrodes that are formed in a substantially equal thickness so as to cover surfaces of portions present on an end face and four sides of the respective quadric prism segments of the conductor film.

A chip component is manufactured through a step of burning a unburned unit element made of ceramics having prism-shaped parts at its ends, a step of polishing the edges of the burned unit element, and a step of forming a resistor conductor, an electrode conductor and a armor on the polished unit element.

Apparatus for manufacturing unit elements for chip components, and chip components mounting structure

Method of manufacturing chip components

Growing community of inventors

Wakayama, Japan

Ikuo Kakiuchi