Ckd Corporation

Utsunomiya University

Kabushiki Kaisha Nextar

Ikuo Futamura

Tsuyoshi Ohyama

Norihiko Sakaida

Takahiro Mamiya

Hiroyuki Ishigaki

Tomoru Okada

Manabu Okuda

Kazuyoshi Kikuchi

Susumu Shibata

Yoshio Hayasaki

A three-dimensional measurement device includes: an optical system including an optical device that splits an incident light, irradiates a measurement object with a measurement light, irradiates a reference plane with a reference light, and combines at least part of the reflected measurement light with at least part of the reflected reference light to emit a combined light; a first light emitter that emits a first light that has a first wavelength; a second light emitter that emits a second light that has a second wavelength; a first imaging device that takes an image of an output light output from the optical device in which the first light enters; a second imaging device that takes an image of an output light output from the optical device in which the second light enters; and a control device that executes three-dimensional measurement of the measurement object.

Three-dimensional measurement device

A three-dimensional measurement device includes: a light emitter; an optical system that splits an incident light, irradiates a measurement object with an object light and irradiates a reference plane with a reference light, and recombines the object and reference lights and emits a combined light; an imaging device that takes an image of a light emitted from the optical system; a storage device that stores transmission axis absolute angle data each obtained by a previous actual measurement of an absolute angle of a transmission axis of each polarizer; and a control device that calculates a phase difference between the reference and object lights based on luminance data of each pixel in luminance image data and the transmission axis absolute angle data of each polarizer corresponding to the pixel, and measures a height of the measurement object at the measurement position.

A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

Substrate inspection device that inspects application quality of adhesive

A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

Component mounting system and adhesive inspection device

A three-dimensional measurement device includes: an illuminator that irradiates a measured object with a predetermined light; an imaging device that comprises: an imaging sensor displaceable at least in a vertical direction; and a both-sided telecentric optical system that causes the imaging sensor to form an image of a predetermined area on the measured object irradiated with the predetermined light; a conveyor that moves the illuminator and the imaging device relative to the measured object; and a controller that: executes three-dimensional measurement of a predetermined measurement object on the measured object, based on the taken image; measures a height of the predetermined area at least at a time prior to imaging of the predetermined area under the predetermined light; and changes a height position of the imaging sensor based on a measurement result to adjust an interval between the predetermined area and the imaging sensor to a predetermined distance.

Three-dimensional measuring device

For measuring the three-dimensional shape of an object of measurement using a phase shift method, a three-dimensional shortening the measurement time. A printed state inspection deviceincludes a printed circuit board K printed with cream solder H, an illumination devicefor illuminating three sine wave light component patterns with different phases on the surface of printed circuit board K, and a CCD camerafor picking-up images of the illuminated part of the printed circuit board K. A control devicecreates a chart representing a relationship between brightness and coordinates for each light component from the image data obtained by the illumination of the light component patterns and determines relative phase angles among the light component patterns, and calculates the height of the cream solder H from the image data and the relative phase angles.

Three-dimensional measuring instrument

A shape measuring device includes a light source for generating slit light beam and a polygon mirror for scanning the light beam and illuminating an object to be measured. The device further includes space-coding light beam controlling means, phase-shifting light beam controlling means, and a CCD camera which picks up an optical image of an object to be measured obtained by illumination of the light beam. The space-coding light beam controlling means controls light beam whose distribution of integrated illumination has a stripe patter in accordance with a predetermined code and the phase-shifting light beam controlling means controls light beam whose distribution of integrated illumination has a sine-wave like pattern. The distribution of integrated illumination intensity is possessed by the light beam illuminating within a time period for picking up one frame. With the picked up image information, space-coding shape operating means calculates a rough shape of the object to be measured, phase-shifting shape operating means calculates a precise shape of the object be measured, and then shape combining/operating means combines and calculates the shape of the object to be measured. Because the device combines a rough shape measured with wide range and a precise shape measured with high resolving power, the device can measure shape with wide dynamic range and with high resolution power.

Growing community of inventors

Aichi, Japan

Ikuo Futamura