Matsushita Electric Industrial Co., Ltd.

Ikuko Obata

Shinjiro Tsuji

Nobuhisa Watanabe

Nobuhiko Muraoka

A TCP mounting apparatus includes a tool storing and holding section having arranged therein a plurality of different kinds of bonding tools which suction tape carrier packages of respective different shapes to heat and pressure bond the tape carrier packages to a liquid crystal panel. The bonding tools are stored at predetermined positions within the tool storing and holding section, and the tool storing and holding section includes a heater for heating the stored and held bonding tools and detector for detecting a presence and absence of the stored bonding tools at each position. A head part is also provided for extracting any selected one of the bonding tools stored and held in the tool storing and holding section. The head part also includes a heater for heating an extracted bonding tool. A conveyor mechanism moves and positions the head part to the predetermined positions of the tool storing and holding section.

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Osaka, Japan

Ikuko Obata