Seoul National University

Korea Inspection Eng. Co., Ltd

Ik Keun Park

Tae Sung Park

Yu Min Choi

In Gon Jung

Seong Jin Lim

Hye Jin Park

Dong Ryul Kwak

Min Jung Park

The present invention relates to a scanner having a flexible probe which is an apparatus capable of being utilized for an inspection on a weld zone of a general ferrite material and a stainless material and allowing an inspection to be performed on a fitting weld zone where it is difficult for a general phased array ultrasonic testing (PAUT) probe to approach. A scanner having a flexible probe according to the present invention includes a probe fixing body () which moves while coming into contact with a surface of a bent fitting pipe and to which a probe body () is fixed, a flexible connecting chain part () installed to be connected to one end of the probe fixing body () and having a freely bendable structure, a sensor installation part () installed on an end of the flexible connecting chain part () and configured to move while pressed against the surface of the fitting pipe, a sensor () which is connected to the probe body () in a flexible state and of which an end is installed on the sensor installation part () and scans a weld zone of the fitting pipe, and an encoder part () installed to be connected at one side of the probe fixing body () and configured to move while pressed against the fitting pipe and detect a moving distance and a position.

Scanner having flexible probe

The present invention relates to a semi-automatic scanner for ultrasonic inspection of a branch pipe weld that has a small size and is able to perform an inspection while moving in a state of being attached to a test object by a magnetic force, thereby being applied to fittings having various shapes, such as a branch pipe and an elbow. The semi-automatic scanner for ultrasonic inspection according to the present invention includes a probe configured to inspect a weld by irradiating ultrasonic waves onto a surface of a test object, a probe holder configured to couple the probe by applying an elastic force so as to be pressed against the surface of the test object, an installation bracket having a rod shape, to which the probe holder is coupled so as to be laterally movable, four wheel units installed on both front and rear side surfaces of the installation bracket so as to be vertically slidable, and four magnet parts, each of which is installed on one of the four wheel units and presses the one of the wheel units against the test object with a magnetic force.

Semi-automatic scanner for ultrasonic inspection of branch pipe weld

Disclosed are a method for measuring the adhesive strength of a thin film using surface waves, and a computer-readable recording medium having a program for performing same recorded thereon. The method for measuring the adhesive strength of a thin film measures the adhesive strength between a substrate and a thin film by means of an electronic calculator, using sound waves measured from a thin film structure having a thin film formed on a substrate. The method, which is performed by the electronic calculator, comprises the steps of: receiving, as a first input value, the thickness, density, longitudinal wave velocity, and shear wave velocity of a first thin film and a substrate the adhesive strength between which is to be measured; calculating, from the first input value, the thickness and density of a second thin film virtually configured between the first thin film and substrate, and setting as a second input value; calculating the longitudinal wave velocity and shear wave velocity of the second thin film according to the stiffness constant of the second thin film, while varying the stiffness constant, and setting as a third input value; using the first to third input values to acquire a transfer matrix between the first thin film, second thin film, and substrate; using the transfer matrix to calculate the dispersion characteristics of the speed of surface waves; and substituting, to dispersion curves, the propagation speed of the surface waves measured from the substrate having the first thin film formed thereon, in order to acquire the stiffness constant matching the propagation speed of the measured surface waves and measure the adhesive strength between the substrate and the thin film.

Method for measuring adhesive strength of thin film using dispersion characteristics of surface waves, and computer-readable recording medium having program for performing same recorded thereon

Growing community of inventors

Seoul, South Korea

Ik Keun Park